显示与光通信LED微型倒装器件设计与制造的基础研究

The basic research of small high-power LED components for display and visible light communication is obviously significant for the national economic and security strategy. This project aims to improving the light quality and reliability of small high-power LED components, in which the study of the design and fabrication methods is a key. Build a precise photometric and colormetric model considering the surface micro/nano-structures and component dimensions. Put forward the corresponding design theory and methods for multi-scale structures to reveal the light extraction mechanism of LED. Study the mechanism of LED chip failure under thermal stress mismatch. Utilize thin AlN/Al2O3 substrates to serve as a stress carrier in the LED package. Unveil the uniformly-wielding principles on a substrate with high isotropic wettability and the formation of complex functionnal structures in a grinding process. Explore the slicing theory of multi-layer material to obtain little-damage, high-efficiency, equal-pitch slicing of chip array. The breakthrough of the design and fabrication methods of small high-power LED flip components will make a great contribution to the economy and society development and strategic security of China.

显示与光通信功率LED微型器件的应用基础研究，直接影响到国家经济与安全战略。项目以解决功率LED微型器件封高品质与高可靠性为突破口，以建立功率LED微型器件封装关键设计、制造理论与方法为目标。研究微纳光功能体/表面结构与器件尺度结构统一的光色精确设计模型，确立跨尺度光功能结构光色设计理论与方法，揭示器件基于尺度效应的出光机制；研究芯片应力失配产生的热-机械机理，提出AlN/Al2O3陶瓷薄膜衬底应力缓冲机制及其相应的封装设计方法，揭示各向同性高浸润性功能形貌均匀焊接机理以及磨削过程中复杂功能形貌可控生成规律；研究多层材料完整性切割机理，实现AlN/Al2O3陶瓷薄膜衬底功率LED微型器件半封装芯片阵列的低损、高效定距精密切割。在功率LED微型器件封装设计与制造理论和方法上取得突破，对我国经济社会发展与安全战略具有重要的意义。

显示与光通信功率LED微型器件的应用基础研究，直接影响到国家经济与安全战略，器件的核心竞争在于微型化、高品质及高可靠性。LED微型器件光色品质主要取决于内部微纳尺度的光功能体/面结构。由于尺度效应，光在器件内部微米和毫米尺度结构传播时存在较大的差异，难以用单一设计方法分析，器件光色精确设计遇到瓶颈。高可靠性主要受温度和应力的严重影响（高功率情况下更严峻），外部应力将直接传导至芯片底部，造成外延层裂纹、芯片失效。本项目以解决功率LED微型器件高品质与高可靠性为突破口，以建立功率LED微型器件封装关键设计、制造理论与方法为目标，重点研究LED微型器件跨尺度光色设计理论及制造方法、LED微型器件的结构设计及制造工艺优化研究、LED微型器件陶瓷衬底材料去除机理及损伤控制理论、LED微型器件陶瓷衬底高完整性与功能微结构协同制造工艺和LED微型器件光功能聚合物结构制造与新型应用研究，推动微型LED器件在显示与光通信领域的应用。