玻璃通孔电磁建模及无源器件集成技术研究

Three-dimensional integration technology is an important solution to avoid the physical limit and cost problems and keep the integrated circuit moving forward with Moore's law. It has incomparable advantages in solving problems such as delay, integration and power consumption, and will become the main direction of integrated circuit development. This project studies the electromagnetic modeling of the through glass via (TGV) and its modified structure, and proposes the structure of microwave passive devices based on the TGV technology. This project studies the broadband accurate modeling of the parasitic effect of TGV, establishes the equivalent circuit in the case of multi-physical field coupling, and proposes the TGV design method and rules; The impedance-level coupling channel model within and between layers are studied, the influence of TGV design parameters on crosstalk noise is quantified, and the noise optimization scheme is proposed. The topological structure and fabrication method of integrated microwave capacitance/inductance/filter based on TGV technology are studied, the equivalent circuit of RLC/RLGC is established, the influence of TGV structure parameters on Q value, resonance frequency, bandwidth and insertion loss is quantized, and the optimal spatial topological structure is proposed. This project solves the basic science problem for the RF application of glass interposer and the high integration of the microwave front-end system.

三维集成技术是避开物理极限和成本问题使集成电路保持摩尔定律向前发展的重要解决方案，在解决延时、集成度、功耗等问题方面有无可比拟的优点，将成为集成电路发展的主要方向。本项目研究三维集成电路(3D IC)玻璃转接板通孔及其变形改进结构的电磁建模，提出基于玻璃通孔(TGV)技术的微波无源器件结构。研究宽频带TGV寄生效应的精确建模，建立多物理场耦合情况下的等效电路，提出TGV设计方法与规则；研究层内与层间的阻抗级耦合通道模型，量化TGV设计参数对串扰噪声的影响，提出噪声优化方案；研究基于TGV技术的集成微波电容/电感/滤波器拓扑结构及制作方法，建立RLC/RLGC等效电路，量化TGV结构参数对Q值、谐振频率、带宽、插入损耗等的影响，提出最优空间拓扑结构。项目为射频玻璃通孔转接板和微波前端系统集成解决基础科学问题。

本项目研究了三维集成电路(3D IC)中玻璃通孔及其变形改进结构的电磁建模，提出了基于玻璃通孔(TGV)技术的微波无源器件结构。研究宽频带TGV寄生效应的精确建模，建立了等效电路；研究了基于TGV技术的集成微波电感拓扑结构及制作方法，建立了RLC/RLGC等效电路，量化了TGV结构参数对Q值、谐振频率、带宽、插入损耗等的影响。并进一步研究了基于硅通孔技术的可配置微波滤波器/双工器/三工器/功分器结构，项目为射频转接板和片上微波前端系统集成解决基础科学问题。