高速集成电路系统级封装电磁-热-应力协同分析设计

Multifunctionalization, miniaturization, low power and low cost are always customer demands and development trends of electronic information systems. The technique of systems on package for high-speed integrated circuits is one of the latest mainstream technologies to achieve these purposes. However, when we use this technology, we should at first make efforts to solve the electromagnetic problem associated with thermal and stress problems. According to the lasted development trends of technology and the major national strategic demands of our country, this project is mainly focused on the collaborative electro-thermo-mechanical analysis and design of high-speed integrated circuit three-dimensional packaging systems, where the electromagnetic, thermal and stress fields coexist and couple with each other at a hybrid multi-physics mechanism. A series of modeling and simulation methods will be proposed for the hybrid multi-physics characterization of some typical scenes in three-dimensional systems on package. The analysis of multi-scale and multi-physics coupling problems in three-dimensional systems on package will be carefully handled. Detailed procedures will be proposed for design and optimization of hybrid electro-thermo-mechanical multi-physical characteristics of three-dimensional systems on package. Based on the collaborative analysis, the collaborative integrated electro-thermo-mechanical design will further be carried out for typical three-dimensional packaging systems, and a series of powerful design tools will be developed. The measurement and testing approaches will also be studied to efficiently evaluate the electro-thermo-mechanical performances of systems on package. Finally, a solid theoretical and methodological basis and related key technologies will be provided, for the rapid development and applications of three-dimensional systems on package of high-speed integrated circuits of our country.

电子信息系统的多功能化、小型化、低功耗、低成本是用户不断提出的要求，也一直是其发展方向。高速集成电路系统级封装技术是实现这些发展方向的最新主流技术之一，但面临着电磁问题及与其相关的热与机械应力问题需要解决。本项目围绕高速集成电路三维系统级封装技术最新发展趋势和国家重大战略需求，拟开展考虑了电磁、热与应力混合多物理场相互耦合、相互制约的高速三维系统级封装的电磁-热-应力协同分析与设计研究，提出一系列面向三维系统级封装中典型场景的混合多物理机制建模和仿真方法，解决三维系统级封装的多尺度和多物理场耦合分析问题，提出三维系统级封装电磁、热与应力特性优化设计的流程与准则，结合协同分析，实现典型三维系统级封装电磁-热-应力一体化设计并得到设计工具，掌握系统级封装的性能测试技术，为我国高速集成电路三维系统级封装技术的快速发展和应用打下坚实的理论方法基础并突破关键技术。

系统级封装是实现电子系统多功能化、小型化、低功耗、低成本的主流技术。随着集成度的不断提高，三维系统级封装中的电磁场、热场、力场相互耦合的特性越来越明显，进行电磁、热与应力的协同分析与设计是必然的发展趋势和要求。本项目针对系统级封装在多物理场仿真和设计集成领域面临的关键基础理论与技术难题进行深入研究，取得了一系列重要的理论成果和关键技术突破。开发了适用于复杂三维系统级封装结构的一系列高效多物理场仿真算法，在此基础上自主开发了功能强大的ETS多物理场实用化仿真软件，已在中物院等多家单位得到应用。设计发明了低损耗、高带宽的高速互连技术和多款高性能的高速信道噪声抑制结构。基于多通道并行传输的基片集成同轴互连阵列，通道间的隔离指标优异，可实现太比特的数据传输率（设计样品支持的最高速率为1.35Tbps，为文献报道的电互连最高数据速率），成功解决了系统级封装芯片间的高速率数据传输难题，已在华为公司试用。提出了电磁-热-应力的协同分析设计方法并成功研制了射频前端模块的系统级封装样品。采用电-热-应力多物理场协同分析技术，揭示了无源元件、有源器件、互连结构和芯片模块及其封装结构的性能参数随温度与应力的变化规律。基于BCB工艺实现了多芯片的封装集成，样品的多物理仿真分析结果与实测结果的一致性较好。在此基础上对工作频率为30GHz的射频前端收发模块进行了协同设计和封装制备，性能指标达到设计要求，体积和重量比现有射频前端模块缩小50%以上。基于项目成果，在IEEE汇刊等权威期刊和会议上发表论文67篇，获得IEEE亚太微波会议（APMC）等国际知名学术会议最佳论文（包括最佳学生论文）4篇，出版学术专著1部，申请国家发明专利10项，软件著作权7项。培养了多名青年学术骨干人才，包括国家自然科学基金青年科学基金获得者2人，德国洪堡学者1人，国际无线电科学联合会(URSI)青年科学家奖获得者1人。项目负责人当选为中国科学院院士。