新型CuO骨架结构Ag-CuO触点材料组织性能调控及电接触特性研究

In traditional low-voltage contact materials with silver-metal oxides (Ag-MeO), the second phase metal-oxides (MeO) are all distributed in the silver matrix, which restricts the arc erosion resistant properties of contact materials. In this project, Ag-CuO contact materials with a new type of CuO skeleton structure will be prepared by using high energy ball milling and hot-pressing techniques, and the effect of the formation mechanism of the CuO skeleton on the mechanical properties and electrical contact properties of Ag-CuO contact materials will be investigated. The mechanical properties and electrical contact properties of the Ag-CuO contact materials can be adjusted by the controlling of the size of CuO skeleton structure. In theory, we will investigated the transformed of the second phase of CuO particles from dispersion strengthening into skeleton reinforcing in hot-pressing processing and it effect on arc behavior and arc erosion. In practice, the application of Ag-CuO materials in low-voltage devices can be expanded by the optimized microstructure of CuO structure under different open circuit current of low-voltage devices. The outcomes of this research will have both scientific significance and industrial application value for improving the performance of traditional silver-oxide contact materials, exploring the preparation methods of contact materials with new microstructure and to clarify the new enhance mechanism of new microstructure on contact materials.

传统银-金属氧化物（Ag-MeO）低压触点材料，第二相金属氧化物（MeO）都是以颗粒的形式分布于银基体中，触点材料的抗电弧侵蚀性能受到限制。本项目采用高能球磨结合热压烧结工艺制备出一种新型具有CuO骨架结构的Ag-CuO触点材料，研究CuO骨架结构的形成机制及其对触点机械性能和电接触特性的影响。通过控制CuO骨架结构的尺寸和大小，实现对Ag-CuO触点机械性能和电接触性能的调控。理论方面，对热压烧结过程中第二相纳米CuO颗粒从弥散强化转变为骨架强化时的形成机理及对触点电弧行为特性和侵蚀特性的影响进行研究；应用方面，针对不同低压电器的开断电流，探索优化CuO骨架的微观结构，扩展Ag-CuO触点在低压电器中的应用领域。本研究对提升传统银-氧化物触点材料的性能，探索具有新型组织结构银-氧化物触点的制备方法，阐明新型组织结构对触点材料的增强机制，具有重要的科学意义和工程应用价值。

传统银-金属氧化物（Ag-MeO）低压触点材料，第二相金属氧化物（MeO）都是以颗粒的形式分布于银基体中，触点材料的抗电弧侵蚀性能受到限制。本项目采用高能球磨结合热压烧结工艺制备出一种新型具有CuO骨架结构的Ag-CuO触点材料，研究CuO骨架结构的形成机制及其对触点机械性能和电接触特性的影响。通过控制CuO骨架结构的大小和尺寸，实现对Ag-CuO触点机械性能和电接触性能的调控。理论方面，对热压烧结过程中第二相纳米CuO颗粒从弥散强化转变为骨架强化时的形成机理及对触点电弧行为特性和侵蚀特性的影响进行研究；应用方面，针对不同低压电器的开断电流，探索优化CuO骨架的微观结构，扩展Ag-CuO触点在低压电器中的应用领域。研究结果表明通过合适的制备工艺，在Ag-45CuO触点中型成了连续分布组织均匀的的CuO骨架结构，随着触点中CuO的含量从20%增大到45%，触点材料的微观硬度提高了2倍，触点的电弧侵蚀速率明显下降。研究结果表明CuO骨架强化Ag-CuO触点表现出良好的抗电弧侵蚀特性。