三维集成电路的电源与热完整性问题研究

Through silicon via (TSV) based three dimensional integration is an effective way to extend Moore's law. The related researches in theory and experiment thus posses both scientific value and huge potential applications. This project studies the electrical and thermal characteristics of three dimensional integration from the two aspects of power integrity and thermal integrity . Firstly, by extracting the accurate frequency dependent resistance-inductance-capacitance-conductance (RLCG) equivalent circuit parameters for various separate components, we develop an equivalent electrical model of power delivery network, derive a compact analytical model for fast predicting the maximum voltage drop in various stratums and propose a TSV placement method for simultaneously satisfying voltage drop in different regions and optimizing silicon area. Based on the law of thermodynamics, a compact thermal analytical model is presented and subsequently employed for estimation of the effect of several design parameters including chip stacked number, chip size, TSV distribution density and package type on the temperature distribution characteristics. A heterogeneous distribution micro-channel is also proposed for temperature cooling. Research results in this project can provide necessary theoretical and technical support for the application of 3-D integration in the future integrated circuit design.

基于硅通孔的三维集成技术是延长摩尔定律的有效途径，相关的理论和实验研究，具有极其重要的科学价值和应用前景。本项目从电源与热完整性两个方面研究三维集成电路(3D ICs)的电热传输问题。通过提取不同分立单元频率相关的电阻、电感、电容、电导等效电学参数，构建3D ICs电源传输网络的等效电学模型，推导适用于快速提取3-D ICs最大电源压降的理论解析方法，提出区域电源压降与设计资源优化的通孔分布策略。考虑硅通孔的热传导效应，建立3D ICs三维热传导解析模型，研究芯片层叠数目、尺寸、硅通孔分布密度和封装类型等设计参数对于系统温度分布影响；提出基于非均匀分布的微沟道冷却技术。本项目的研究成果可为三维集成技术应用于未来集成电路设计提供必要的理论和技术基础。

硅通孔(TSV)三维集成技术在CMOS图像传感器、高带宽存储器、异质微系统等领域具有广阔应用前景，相关理论与技术研究具有重要的科学价值。本项目从硅通孔互连建模与电热传输两个方面展开研究。基于同轴传输线理论，提出了表面铜中心硅的同轴TSV结构，提取同轴TSV的电阻-电感-电容-电导参数，建立了硅芯同轴通孔的电热传输模型，解决了同轴TSV信号传输质量出色与工艺制作成本高的长期矛盾。基于TSV的集成无源器件技术，通过非功能性TSV实现了电感器与电容器的高密度片上集成，提取电感器与电容器等效电学参数，并将其分别应用于射频滤波器与线性稳压电路设计，显著减小了无源器件及其电路的尺寸，为传感节点芯片的微型化设计提供一种新的技术途径。研究了三维集成微传感系统的供能问题，采用垂直TSV与水平分布层构建了正交接收线圈，增强了无线功率接收电路在线圈偏移下耦合系数与功率传输效率；进一步设计高转换效率的有源整流电路与低能耗的数字化线性稳压电路，实现了全集成高能效的三维功率接收系统。本项目的研究成果可为微型化异质集成传感节点设计提供必要的理论基础与技术支持。