典型金属/金属体系润湿铺展过程的相场分析建模与试验

In the field of brazing and soldering, there are challenges for moldeling of the processes of the wetting and spreading kenitics, substrate dissolution and elements diffusion due to the difficulties induced by the interconnection complex phase-fields. In this project, moldeling and experiments of the wetting and spreading processes of the selected metal/metal systems will be conducted based on the analysis of the associated multi- phases and fields, i.e. reactions, elements diffusion, substrate dissolution. Three typical metal/metal systems are selected for the wetting and spreading experiments: Sn based fillers/Cu and CuSn intermetallics substrates,Al based fillers/Al based alloys, and Ag based fillers/TC4 and TiAl substrates. Wetting and spreading experiments on the roughness controlled surfaces and structrue designed surfaces will be carred out in the hot stage,during which the triple line movement and contact angel development will be recorded using the microscropy, the substrate dissolution will also be observed and calculated. Based on the results of the proposed experiments listed above, the influences of the surface roughness and surface structural characteristics on the wetting and spreading will be understood well; a physical-mathematical model of the substrate dissolution will be presented; in addition, a wetting spreading model will be proposed based on the comprehisive understanding of complex interaction of the interfical reaction, substrate dissolution and elements diffusion.

针对目前钎焊领域，控制钎焊质量的润湿铺展与溶解扩散等多相、场耦合过程和三相线动力学建模存在的困难，提出采用“相-场”模型理论对钎焊、电子封装相关的典型金属/金属润湿铺展过程以及涉及到的多相场问题进行建模分析与试验研究。选用具有代表性的体系，Sn基低温焊料/Cu和CuSn金属间化合物基板、Al基中温焊料/Al合金基板、Ag基高温焊料/TC4和TiAl基板，进行控制表面粗糙度和形态结构的原位润湿铺展试验；实时测试三相线移动的动力学数据和润湿角变化；观测计算基体母材在润湿铺展过程中的溶解数据。基于上述试验过程研究母材表面粗糙度和结构形态对润湿铺展过程的影响规律，建立钎焊过程中的母材溶解规律量化模型，进而综合考虑化学反应、溶解扩散等效应建立基于相-场理论的钎焊润湿铺展模型。

针对目前钎焊领域，控制钎焊质量的润湿铺展与溶解扩散等多相、场耦合过程和三相线动力学建模存在的困难，提出采用“相-场”模型理论对钎焊、电子封装相关的典型金属/金属润湿铺展过程以及涉及到的多相场问题进行建模分析与试验研究。选用具有代表性的体系，Sn基低温焊料/Cu和CuSn金属间化合物基板、Al基中温焊料/Al合金基板、Ag基高温焊料/TC4和TiAl基板，进行控制表面粗糙度和形态结构的原位润湿铺展试验；实时测试三相线移动的动力学数据和润湿角变化；观测计算基体母材在润湿铺展过程中的溶解数据。基于上述试验过程研究母材表面粗糙度和结构形态对润湿铺展过程的影响规律，建立钎焊过程中的母材溶解规律量化模型，进而综合考虑化学反应、溶解扩散等效应建立基于相-场理论的钎焊润湿铺展模型。