考虑工艺偏差的MEMS器件设计方法研究

Process deviations during the fabrication of MEMS devices will lead to the variation between the design and fabrication results, even directly lead to device failure. This limits the industrialization of most MEMS devices, especially high performance MEMS transducers. Thus design for manufacturing becomes one of frontier issues in MEMS design area. This project will conduct following researches: (1) The process deviations with influence on the performance of MEMS devices are systematically analyzed; (2) Based on the basic behavior model of MEMS devices, the process deviations are abstracted as the interference terms (Delta) of the parameters in the basic behavior model. By through variables, cross variables and coupling variables, the process deviations are incorporated into the basic behavior model, resulting in a device model that can reflect the dynamic characteristics of process variations. By analyzing the influence from different process deviations, key process deviations with relatively larger influence on the performance are extracted; (3) The multi-parameter analysis model considering process deviations for MEMS devices are established. Our goal is to provide an efficient design method considering the process deviations to improve the accuracy and yield of MEMS devices, this is useful for the industrialization of most MEMS devices.

工艺偏差（材料参数、几何尺寸、掺杂浓度等）容易造成MEMS器件实际制造与设计结果之间偏离，甚至导致器件性能不满足要求，因此，可制造性设计已成为MEMS设计的前沿课题之一。本项目将研究：①加工过程中影响MEMS器件性能的工艺偏差来源统计分析；②基于MEMS器件的行为模型，将工艺偏差抽象为该模型参数的干扰项（△），并将△通过穿量、跨量以及耦合加入原模型，得到可反映工艺偏差动态特性的器件模型分析不同工艺偏差对MEMS器件性能的影响，提取出对器件性能影响较大的关键工艺偏差；③提出考虑工艺偏差的MEMS器件性能多参数分析方法。本项目的创新之处是探索并提供一种通用的考虑多种工艺偏差的MEMS器件设计方法，通过优化设计降低MEMS器件性能对工艺偏差的敏感度，提高MEMS器件的性能和成品率。

工艺偏差容易造成MEMS器件实际制造与设计结果之间偏离，甚至导致器件性能不满足要求，因此，可制造性设计已成为MEMS设计的前沿课题之一。本项目研究了加工过程中影响MEMS器件性能的工艺偏差来源统计分析；基于MEMS器件的行为模型，分析了不同工艺偏差对MEMS器件性能的影响，提取出对器件性能影响较大的关键工艺偏差；提出了基于广义多项式混沌方法（GPC）的考虑工艺偏差的MEMS器件性的分析方法。本项目以MEMS悬臂梁、双端固支梁、压阻式压力传感器为例，分析了工艺偏差对梁谐振频率和压力传感器灵敏度的影响，并利用Monte Carlo仿真和有限元分析验证了所得分析结果。