宽带硅基三维光电集成关键技术的基础研究

Three-dimensional (3D) integration can effectively reduce the interconnect length reduce power consumption, improve performance and support heterogeneous devices integration. Optical interconnection is superior to copper interconnect based on fast transmission speed, low power consumption and unlimited to interconnect length and I/O density. Therefore, combined 3D IC and optical interconnect, high-speed, device miniaturization and low power consumption can be effectively achieved. This project focuses on the development of high bandwidth, compact and reliable 3D optoelectronics integration. To realize the broadband transmission with single channel beyond 25Gbps, study on the delay, loss and distortion of the high-speed optical signal in various optical waveguide, and mode coupling, photon field enhancement and attenuation principle in the conversion between multi-mode and single mode, and the impact of optical structure on the transmission bandwidth will be performed. Moreover, some research on the electrical model of TSV and related interconnection structure, the interconnection impact on the active device, bandwidth extension technology, the effective coupling between active and passive devices and integration technology of micro-optical element, the leakage, loss and shielding of the microwave interconnection, optimization of the optoelectronic integration structure and minimization of the device size will also be taken. To realize the stable transmission system, the power consumption and heat management of 3D integration system will be investigated. The goal of this study is to grasp the key manufacturing process of the interposer including optical and electrical via and heterogeneous integration, and complete the integration of multiple functional devices on one chip, which can be the foundation for high-density, large-volume and low-power optical interconnection intra and inter chips.

三维集成可以有效缩短连线长度、降低功耗、提高性能并能提供异质器件集成；光传输具有传输速度快、功耗低以及不受互连I/O密度限制等优势，二者结合能有效实现高速光子-电子器件小型化、高带宽以及低能耗。本项目拟开展宽带、紧凑型、高可靠性三维光电集成基础技术研究：为实现单通道大于25Gbps的宽带传输，研究高速光信号在各种光波导中的延迟、衰减与畸变现象，多模和单模模式转换中的模式耦合、光场衰减与模班匹配，分析各种光学结构对传输带宽的影响；研究TSV及相关互连结构电学模型，研究微波互连泄漏、损耗以及屏蔽，分析互连对有源器件的带宽影响，研究带宽扩展技术；为实现超紧凑的光电集成，研究有源器件与无源结构的高效耦合、微光元件集成技术；优化光电集成结构，缩小器件尺寸；为实现稳定的传输系统，研究电子和光子集成系统功耗以及散热管理，掌握光电信号同传转接板和光电子异质集成的关键制造工艺，实现多个功能器件的准单片集成。

研究背景：高密度集成可以有效缩短连线长度、降低功耗、提高性能并能提供异质器件集成；光传输具有传输速度快、功耗低以及不受互连I/O密度限制等优势，二者结合能有效实现高速光子-电子器件小型化、高带宽以及低能耗。.研究内容：研究了光信号模场匹配与耦合技术；研究了光有源器件与光无源结构的高效耦合、微光元件集成技术；研究了互连结构的电学模型、泄漏、损耗以及屏蔽技术；为实现稳定可靠的传输系统，分析了电子和光子集成系统功耗以及散热管理技术；设计了一种光电子三维集成的结构，正在开展工艺研究。.研究结果：针对插入/反射损耗、串扰等电学互连特性开展研究，实现了带宽扩展，实现单通道大于25Gbps的宽带传输；结合实际的应用需要，分析了光栅与光纤耦合的封装特性，采用硅光子调制器和探测器芯片，实现了CPU和处理器之间的50Gbps带宽的互连技术；提出了一种无需光学转向的片上混合集成光源结构，并开发集成90度金属转弯的基板；设计了一种光电三维集成结构，已经完成结构设计、版图设计、以及热管理，正在进行流片。.科学意义：结合高性能计算的发展趋势和未来高速光电互连系统的具体需求，研究涉及了微电子、光电子、微波、MEMS 等技术，结合了光学耦合、带宽扩展、工艺兼容等前沿研究方向，旨在探索多学科混合集成系统的基础技术，为低功耗、大容量片片间光互连提供技术支撑。