Optical waveguide amplifier is an crucial device to solve the loss problem in optical communication and photonic integrated circuits. For the end face pumping waveguide amplifier, the pump light is exponential decay with the transmission distance, which restrict the performance of the device. The project proposed a hybrid integrated 3D structure to solve the pump problem. Polymer as the medium of amplification, has the advantage of high doping concentration of rare earth ions, characteristics of uniform distribution; glass waveguide is function as the pumping light path to solve the problem of polymer tolerance; by electronic field assisted ion exchange and polymeric slope construct, three-dimensional structure can be achieved. In non pumped area, the optical path in polymer and inorganic waveguides are transmitted independently; in pumping area, the optical path can be controlled by electrode in order to achieve three-dimensional pump. Project focuses on research the optical transmission and optical coupling mechanism between the step refractive index and graded refractive index waveguide. Polymers and glass waveguides transmission and coupling model is established. The analysis of distribution of the optical filed in the hybrid structure of opposite thermo optic coefficient are going to be investigated. Grayscale lithography and nano imprint are going to be researched as the three-dimensional chip core technology. Project intends to achieve a three-dimensional pump hybrid waveguide amplifier with hierarchical input and output, adjustable 3D optical path, power distribution ratio of 10% - 90% and relative gain more than 25dB.
光波导放大器是解决光通信和光子集成芯片损耗问题的重要器件。目前光波导放大器主要采用端面泵浦方式,但泵浦光随传输距离存在指数衰减,严重制约器件性能。本项目提出混合集成三维泵浦结构解决泵浦效率问题。项目以掺杂浓度高、分布均匀的稀土键和聚合物作为放大基质,以泵浦光耐受性高的玻璃波导作为泵浦光路,通过电场辅助离子交换和聚合物梯度斜面构建三维结构。实现在非泵浦区,光路在聚合物波导和无机波导上独立传输;在泵浦区,光路通过电极控制在聚合物波导和无机波导间切换,从而通过三维泵浦提高泵浦效率。项目重点研究阶跃折射率和渐变折射率波导光传输和光耦合机理,完善聚合物波导与玻璃波导间传输及耦合理论,分析热光系数相反的复合型三维光波导在热场作用下的功率分配过程,掌握灰度光刻与纳米压印结合的三维芯片核心技术。拟研制分层输入输出,光路层间能量比率10%-90%可调,相对增益大于25dB的光波导放大器。
光波导放大器是解决光通信和光子集成芯片损耗问题的重要器件。目前光波导放大器主要采用端面泵浦方式,但泵浦光随传输距离存在指数衰减,严重制约器件性能。本项目采用混合集成三维泵浦结构解决泵浦效率问题。项目以掺杂浓度高、分布均匀的稀土键和聚合物作为放大基质,以泵浦光耐受性高的无机波导作为泵浦光路,通过垂直泵浦结构和模式隔离技术。实现在非泵浦区,光路在聚合物波导和无机波导上独立传输;在泵浦区,光路通过电极控制在聚合物波导和无机波导间切换,切换功耗小于30mW。项目构建comsol阶跃折射率和渐变折射率波导光传输和光耦合模型,分析热光系数相反的复合型三维光波导在热场作用下的功率分配过程,发表压印、光漂白及石墨烯电极相关专利。三维光放大器,光路层间能量比率1%-99%可调,相对增益大于30dB的光波导放大器。
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数据更新时间:2023-05-31
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