大功率高集成度IGBT IPM关键技术研究

As the "CPU" of power electronic converter, IGBT is recognized as the most representative products of the third time revolution in the power electronic technology field, and it has become the inevitable trend for the future application of the power electronic device development. IPM (Intelligent Power Module) is the further development technology to reduce the parasitic effects and improve functional integration of IGBT. In order to solve the existing blind zone problem of current measurement and short circuit protection in high power IPM, this project proposes a current measurement scheme of integrated shunt in DBC(Direct Bonding Copper) substrate, the over-current protection can be conducted using the integrated shunt together with the current measurement. This project will explore the key technologies of IPM with high power and high integration based on this scheme. The impact of DBC substrate integrated shunt on internal thermal field of IPM module through finite element analysis method will be analyzed, and the DBC layout optimization method would be proposed. The research on multistage intelligent soft turn-on and turn-off drive and protection strategy based on the integrated shunt scheme will be carried out to reduce the switching power loss and improve the reliability of IPM. At the same time, in order to improve the integration and reliability of IPM, high precision digital analog mixed integrated circuit design method would be introduced to the high-power IPM, so as to lay the theoretical and experimental foundation for the research and development of high power IPM.

作为电力电子变流设备的"CPU"，IGBT成为未来电力电子器件应用发展的必然方向。IPM（Intelligent Power Module，智能功率模块）是为减小IGBT寄生效应和提高功能集成度进一步发展的产物。为解决现有大功率IGBT IPM中电流测量和短路保护存在的问题，本项目提出DBC（Direct Bonding）底板集成分流器的电流测量方案，利用集成分流器同时实现电流测量和短路保护，探索基于此方案的大功率高集成度IPM关键技术。通过有限元分析法分析出集成分流器对IPM模块内部热场的影响，提出DBC版图排布优化方法；研究基于DBC底板集成电流器的多级智能软开通和关断驱动保护策略，减小IGBT开关功率损耗，提高可靠性；同时，为提高IPM可靠性和集成度，本项目拟将高精度数模混合集成电路设计方法引入到大功率IPM中，实现其驱动保护电路的单芯片集成，为大功率IPM的研发奠定理论和实验基础。

IGBT作为电力电子变流设备的核心部件，在电力电子器件中具有举足轻重的地位。IPM（Intelligent Power Module，智能功率模块）是为减小IGBT寄生效应和提高功能集成度进一步发展的产物。本项目针对大功率高集成度IGBT IPM关键技术进行研究，提出DBC底板集成分流器的电流检测方案，基于该方案，主要围绕IPM功率单元的结构设计与仿真分析、IGBT智能驱动保护策略研究和大功率IPM驱动保护电路的芯片研究三个方面探索大功率高集成度IPM关键技术。通过建模分析了功率单元的热分布和寄生参数提取，完成了大功率IPM功率单元DBC底板集成分流器方案设计和IPM功率模块结构优化。为了解决IGBT功率损耗和电流、电压过冲之间的矛盾，提出了集成分流器的基于dv/dt与di/dt反馈控制的大功率IGBT和SiC MOSFET分阶段驱动保护方案，在不同的开通和关断阶段对器件驱动强度进行优化，通过实验验证该方案效果良好，实现了低开关损耗、高可靠性的驱动目标。同时，为了实现模块的高集成度，设计了针对大功率IPM的驱动保护芯片，并完成了流片与测试。测试结果表明，专用驱动芯片可实现IGBT的驱动保护功能。该芯片可以为不同型号IPM模块提供多模式智能驱动保护，用户可根据具体使用环境对芯片功能进行灵活配置，简化驱动外围电路。