CNTs-W/Cu体系先进热管理复合材料的微结构设计、调控及其性能增强机制

Based on the objective of obtaining high performance CNTs-W/Cu system advanced thermal management composite material, this research studied the design of the micro-structure (interfacial phase and reinforcement phase) and the composition of the composite in order to solve the three main problems: uncontrolled Cu network interconnection structure, poor wettability between W and Cu and inability to balance between thermal properties and mechanical properties using different sintering aids (including different types, amounts and locations). Firstly, this research performed a detailed study of the interface modification and preparation of the composite coated Cu@X@W particles enhanced with minor restricted region addition of nano interfacial modification layer X and Cu@CNTs nanocomposites with uniformly dispersed, core-shell structure. Secondly, we evaluated the effect of the surface modification, double-coated structure and the CNTs on the low-temperature densification, micro-structure, mechanical properties and thermal electrical properties to find out the interface modification and properties reinforcement mechanisms. Finally we obtain the fabrication and structure control techniques, thus the perfect structure and high performance of the CNTs-W/Cu system advanced thermal management composite material. The expected results of the project are aim to provide basic technical supports for large scale integrated circuit, high power microwave device and LED lighting system in the fields of the aspects of aeronautics, astronautics and military.

以获得高性能CNTs-W/Cu体系先进热管理复合材料为研究目标，针对其Cu网互联结构难以获得、W-Cu界面润湿性差、以及烧结助剂的含量和添加区域与热学、力学性能难以兼顾的三大科学难题，开展其微结构（界面相及其增强相）及组分含量的设计研究，研究微量定区域添加纳米尺度界面改性层X的Cu@X@W复合包覆粉体和具有包覆结构、均匀分散的Cu@CNTs纳米复合粒子的制备工艺及形成规律，综合评价界面修饰、复合包覆结构及CNTs对复合材料低温致密化、微观结构、力学性能、热、电性能的影响，研究其界面改性的机制与性能增强机理，获得具有结构理想、性能优异的CNTs-W/Cu体系先进热管理复合材料及其制备、结构控制技术。项目的预期成果可为航空航天、军事等领域的大规模集成电路、大功率微波器件、大功率LED照明系统的电子封装材料及热沉材料等先进热管理材料的开发提供基础技术支持。

项目以先进热管理符合材料的应用需求为研究背景，以热管理材料应用所需的优异的热学性能（高热导率、低热膨胀系数）、良好的力学性能和电导率为研究目标。涉及W-Cu体系复合材料的体系设计、组分合成与结构的调控、性能优化及机制分析等研究。达到以下研究目标：完成W粉表面修饰及Cu@C@W复合包覆粉体的工艺优化，研究了CNTs的表面改性及Cu@CNTs纳米复合粒子的合成，并分析了复合包覆层的生长形成机制；研究了不同工艺参数对CNTs-W/Cu体系复合材料致密化及微观结构和性能的影响；对材料进行力学性能、热学性能、电学性能的测定并进行模拟计算；对CNTs-W/Cu体系复合材料结构、界面改性、功能相引入对性能的增强机制进行了深入研究。最终制备出致密、结构理想、具有高热、电、力学性能的CNTs-W/Cu体系热管理复合材料。