基于复合弹性研抛盘的非晶薄膜衬底分级研抛新方法研究

According to the process needs of amorphous thin-film substrate, such as less and no damage, ultra-smooth and high accurate, a new grading lapping and polishing method based on composite elastic disk was proposed. The following is the principle and innovation of this new method. The abrasive particles are elastic consolidated in the composite elastic disk. The mechanical properties of the composite elastic help to form the elastic support and mechanical behavior constraints of the abrasive particles and achieve the soft contact between abrasive and substrate. Realize the self-conditioning of the grading lapping and polishing disk due to the materials swelling and fall off in the processing by make use of the water absorption polymer. It ensures the substrate flatness and extends the life of the disk. Because of the grading design of the composite elastic disk surface, grinding and polishing process can be continuously done in one disk. The use of the structured flow passage improves the liquid-solid flow properties. Apply the automation control, the contact pressure, relative velocity and other parameters between the substrate and the disk can be actively controlled. As well as, carrying out multi-objective process experiments to effectively reduce the subsurface damage and residual stress, and obtain the processing accuracy and ultra-smooth surface at the same time. This research has important practical significance in promoting the development of amorphous materials and photovoltaic technology, and enriching the ultra-precision theory, in particular, amorphous thin-film substrate processing theory and technology. It also provides guidance in ultra-precision machining of optical components and semiconductor materials.

针对非晶薄膜衬底少、无损伤，超光滑和高精度表面的加工需求，提出基于复合弹性研抛盘的分级研抛新方法，其原理和创新是：将磨粒弹性固结于复合弹性研抛盘，利用复合弹性层的力学性能，形成对磨粒的弹性支撑和柔性力学行为约束，实现磨粒与衬底的软性接触；采用吸水高聚物实现研抛盘的溶胀磨削脱落自修整功能，保证衬底平面度，延长研抛盘使用寿命；利用表面分级设计，在一个研抛盘上实现研磨和抛光工序的连续衔接；利用结构化流道，改善研抛盘上液固两相的流动性能等；利用自动化控制，实时调控衬底与研抛盘之间的接触压力和相对运动速度等，进行多目标工艺实验，以期在获得衬底加工精度和超光滑表面的同时，有效减少其表层亚表层的损伤和残余应力等。本项目的研究对促进非晶态材料和光伏技术的发展，丰富超精密加工理论，特别是非晶薄膜衬底的相关加工理论和技术，具有重要的现实意义，对光学元件、半导体材料的超精密加工也有一定的指导和应用意义。

针对非晶薄膜衬底少、无损伤，超光滑表面的加工需求，提出了一种基于复合弹性研抛盘的分级研抛新方法。将磨粒弹性固结于分级复合弹性研抛盘，利用粘磨层的力学性能，形成对磨粒的弹性支撑和柔性力学行为约束，实现磨粒与铜片工件的软性接触，为获得超光滑表面铜片，并有效减少其亚表层损伤和残余应力提供了保障。本项目的主要成果有：建立了粘磨层弹性模量预测模型；确立了复合弹性层的基本结构、尺寸参数等；研究了粘磨层磨粒群受力特征和材料去除模型；制备了分级复合弹性研抛盘；建立了通过负压固定工件的自动化分级研抛原型系统；研究了接触区应力分布及变形情况；分析了SAP的溶胀特性；提出了多因素多目标分析方法；进行了拉伸，纳米压痕，SEM、TEM等测试；实验研究初步实现了铜片Ra 4nm以下的高质量加工。本项目了解和掌握了相关科学规律，积累了数据，得到了一些具有工程指导意义的理论模型，对促进非晶态材料和光伏技术的发展，丰富超精密加工理论，特别是非晶薄膜衬底的相关加工理论和技术，具有重要的现实意义。