非活性Cu钎料耦合电流钎接金属(304S-S/Ni)与ZrO2陶瓷

Brazing has been widely used and investigated in terms of its structural reliability and economical industrialization in many methods for joining metals. The conventional researches pay attentions to the active filler metals and the dissolution, diffusion and adsorption of active elements in base metals, seldom conceiving of the effect of introduction of an external field. In the light of the experimental fact of the changes in the atomic transfer and reaction behavior by applying current as well as a triune relationship of wetting-interfacial microstructure evolutino-brazing,we proposed in this project a thought of the joining of Zirconia and metals using inactive Cu fillers under electric current. we intend to use a wettability testing system by passing a current through a sessile drop and distinct "sandwich" and "double joint-multi layer " brazing structures during the experiment. we are to probe into the influences of various factors such as current intensity, polarity, AC frequency, temperature and times on wetting, mass transfer, reaction and properties of brazing joints under current. The research results are expected to provide important guidance and references to control the wetting and interfacial behavior using a current as well as provide new ideas for restraining the phase transition of ZrO2, promoting the high-temperature properties of the joints and optimizing brazing process of metals-ZrO2 ceramics.

在连接金属和陶瓷的方法中，钎焊因其工艺简单、连接强度高、可靠性好等优点而备受关注。传统的钎焊研究专注于以活性钎料和母材活性元素溶解、扩散和吸附，而很少考虑外场的引入。本项目基于通电改变界面传质和反应行为的实验事实，以润湿-界面显微结构演变-钎焊三位一体的构架，提出了纯Cu钎料耦合电流钎焊金属与ZrO2陶瓷的构想。实验上利用电流耦合座滴润湿测试系统以及独特的"三明治"和"双接头多层"钎焊织构，探索电流强度、极性、交流频率、温度和通电时间等因素对体系润湿、传质、反应以及钎焊接头性能的影响。研究结果将为电流调控液-固界面的润湿和界面行为提供新的重要的参考和指导，同时为抑制钎焊过程中的ZrO2相变，提升钎焊接头高温性能以及优化金属-ZrO2陶瓷的钎焊工艺提供新的思路。

在连接金属和陶瓷的方法中，钎焊因其工艺简单、连接强度高、可靠性好等优点而备受关注。传统的钎焊研究专注于以活性钎料和母材活性元素溶解、扩散和吸附，而很少考虑外场的引入。本项目基于通电改变界面传质和反应行为的实验事实，以润湿-界面显微结构演变-钎焊三位一体的构架，提出了纯Cu钎料耦合电流钎焊金属与ZrO2陶瓷的构想。实验上利用电流耦合座滴润湿测试系统以及独特的"三明治"和"双接头多层"钎焊织构，探索电流强度、极性、交流频率、温度和通电时间等因素对体系润湿、传质、反应以及钎焊接头性能的影响。研究结果为电流调控液-固界面的润湿和界面行为提供新的重要的参考和指导，同时为抑制钎焊过程中的ZrO2相变，提升钎焊接头高温性能以及优化金属-ZrO2陶瓷的钎焊工艺提供新的思路。依托电流场辅助下金属-固体电解质陶瓷的研究成果，我们针对目前CCGA焊柱的低孔隙率制备问题进行了工艺优化。研究发现，在适当的温度下，只要对体系施加一个微小的电流场，由于界面润湿性的改善，焊柱的Cu薄带与焊芯之间就能形成更可靠的焊接。同时，依托前期的研究成果，我们还对电流场辅助镁合金低温连接技术进行了探索，研究发现，对镁合金钎焊偶施加电流场使钎焊效果更好，同时可以有效地避免界面的氧化和过度烧损等问题。这些工艺的开创性探索说明电流场辅助钎焊具有广阔的工业应用前景，尤其在一些特定和极端条件下，电流场的诱导作用更为突出。