柔性无机电子元件的抗冲击性能优化研究

In this project, both experimental and theoretical investigation of impact resistance properties of flexible inorganic electronic components (FIEC) composed of inorganic film and soft materials substrate will be be performed. The objective of the proposed research is twofold: (1) to develop a continuum modeling to explore the characteristics of the wave propagation and impact resistance properties of FIEC, (2) to provide experimental verification for the larger area integration and engineering applications of FIEC..To accomplish these objectives, the following four tasks will be carried out in this project. They are (1) developing the mathmatical model accounting for the impact resistance properties of FIEC in conjunction with flexible electronics reverberation-ray matrix method (FE-RRMM); (2) detecting the stress wave propagation characteristics of FIEC as well as its laminated structures, and the interfacial properties between inoganic film and soft substrate, (3) exploring the roles of film-substrate interactions and viscoelasticity on the viscoelastic wave propagation, (4) comparing FE-RRMM, finite element method simulations with experimental measurements..The purpose of this research will establish the evaluation program based on theoretical and experimental investigation of impact resistance properties of FIEC, provide new insights that will enable the tailoring the structural composition of FIEC to optimize their impact resistance performances, and provide a better understanding and design guidelines for improving the stabiltity of FIEC.

本项目进行柔性无机电子元件抗冲击性能基础性与检验性试验的优化研究，揭示无机薄膜/软基底及其层合结构中波传播特性和抗冲击性能随载荷幅值变化的规律，并为柔性无机电子元件的大面积集成和工程应用提供检验性例证。建立柔性无机电子元件抗冲击性能的回传射线矩阵理论分析模型；计及软基底的粘弹性效应，提出柔性无机电子元件抗冲击性能分析的回传射线矩阵方法（FE-RRMM），分析应力波在柔性无机电子材料及其层合结构中的传播特性、无机薄膜与软基底的界面效应，以及软/硬材料界面的相互作用对粘弹性波传播的影响规律和粘弹性效应的发生机理。由试验结果检验FE-RRMM方法和有限元数值模拟分析柔性无机电子元件抗冲击性能科学问题的有效性和可靠性。研究成果将给出柔性无机电子元件抗冲击性能的优化方案，探索建立此类柔性电子元件抗冲击载荷能力的试验和数值评估体系，为提升此类柔性电子器件性能的稳定性和大范围应用的优化设计给予理论指导。

本项目进行了柔性无机电子元件抗冲击性能基础性与检验性试验的优化研究，初步揭示了无机薄膜/软基底及其层合结构中波传播特性和抗冲击性能随载荷幅值变化的规律，并为柔性无机电子元件的大面积集成和工程应用提供检验性例证。初步建立了柔性无机电子元件抗冲击性能的回传射线矩阵理论分析模型；计及软基底的粘弹性效应，提出柔性无机电子元件抗冲击性能分析的回传射线矩阵方法（FE-RRMM），但仍有待进一步修正方法，分析了应力波在柔性无机电子材料及其层合结构中的传播特性、无机薄膜与软基底的界面效应，以及软/硬材料界面的相互作用对粘弹性波传播的影响规律和粘弹性效应的发生机理。由试验结果初步检验了FE-RRMM方法和有限元数值模拟分析柔性无机电子元件抗冲击性能科学问题的有效性和可靠性。研究成果给出了柔性无机电子元件抗冲击性能的柔性基封装层厚度比的优化方案，探索性初步建立了此类柔性电子元件抗冲击载荷能力的试验和数值评估办法，为提升此类柔性电子器件性能的稳定性和大范围应用的优化设计给予理论指导。