真空平板玻璃封边界面效应与多场耦合作用机理及其性能优化控制研究

In the jointing process of the vacuum plate glass, the cooling rate of different temperature step and the thermo-mechanical coupling interaction of different vacuum can altere the growth morphology and the grain's size of the solder, the diffusion depth and density of the elements caused by the affinity elements between the jointing interface of the solder and the glasses, as well as according the change of the edge sealing scale, shape, stress and temperature distinguishing feature, microstructure and thermodynamics function. It leads to the vacuum plate wastage caused by inadequate control of the edge sealing solder solidification. So the science's essence of interfacial effect and coupling multi-field effect mechanism of solder and optimal control of edge sealing property in vacuum plate glass is still unrevealed. The main study content is listed as follows: (1) the thermo-mechanical coupling interaction mechanism during the edge sealing solder solidification; (2) the interface's influence mechanism during the edge sealing solder solidification; (3) the representation and the evaluation of the edge sealing property; (4) the optimal model and the control of the edge sealing property. All the study has a very important theoretical and practical value on determining and optimizing the sealing solder and the sealing technique of the vacuum plate glass, improving the processing quality and production efficiency, decreasing the cost of production, and driving scientific research of the vacuum plate glass and the development of the deep-seated high-end product.

真空平板玻璃封接过程中不同温度梯段的降温速率、不同真空度的热力耦合作用可改变焊料的生长形态、晶粒粗细，以及焊料与玻璃结合界面之间元素亲和性引起的元素扩散深度与扩散浓度，由此引起真空平板玻璃封边尺度、形态、应力与温度分布特征、微观组织结构与热力学性能的改变，易造成由封边焊料凝固过程的控制不当而引起真空平板玻璃报废的现象，因此，真空平板玻璃封边界面效应与多场耦合作用机理及其性能优化控制的科学实质有待揭示。本课题就下述内容进行重点研究：（1）真空平板玻璃封边焊料凝固过程的热力耦合作用机理；（2）封边焊料凝固过程的界面影响机理；（3）封边性能的表征与评价；（4）封边性能的优化模型与控制。所有上述研究，对确定与优化真空平板玻璃封边焊料与封接工艺，提高加工质量与生产效率，降低生产成本，推动真空平板玻璃的科研和深层次的高端产品开发有着重要的理论价值和现实意义。

真空平板玻璃封接过程中不同温度梯段的降温速率、不同真空度的热力耦合作用可改变焊料的生长形态、晶粒粗细，以及焊料与玻璃结合界面之间元素亲和性引起的元素扩散深度与扩散浓度，由此引起真空平板玻璃封边尺度、形态、应力与温度分布特征、微观组织结构与热力学性能的改变，易造成由封边焊料凝固过程的控制不当而引起真空平板玻璃报废的现象，因此，真空平板玻璃封边界面效应与多场耦合作用机理及其性能优化控制的科学实质有待揭示。本课题就下述内容进行重点研究：（1）真空平板玻璃封边焊料凝固过程的热力耦合作用机理；（2）封边焊料凝固过程的界面影响机理；（3）封边性能的表征与评价；（4）封边性能的优化模型与控制。所有上述研究，对确定与优化真空平板玻璃封边焊料与封接工艺，提高加工质量与生产效率，降低生产成本，推动真空平板玻璃的科研和深层次的高端产品开发有着重要的理论价值和现实意义。