磨料分布与转速比耦合下的固结磨料最优磨抛轨迹研究

Lapping and polishing with fixed abrasives has the advantages of high processing efficiency, well controllability of the workpiece shape accuracy and abrasive path, etc., which is the future development trend for the substrate material processing. The path of Lapping and polishing is the result of the highly coupling of abrasive distribution and rotate speed ratio, which directly affects the processed surface quality and processing efficiency. Previous studies have focused on the a single abrasive in polishing, the effect of the coupling of abrasive distribution and rotate speed ratio was not considered and it is hard to gain optimal path. Assume that the uniform distribution of abrasive is the best. However, it is hard to achieve the desired effect of processing, such as surface quality. Therefore, study on optimal path with the coupling of abrasive distribution and rotate speed ratio is put forward in local project, there are three main research contents: 1) Establishing the path model and its evaluation method, and analyzing the basic law of path; 2) Presenting the extract method of abrasive distribution for specific tool matching the best rotate speed ratio; 3) Presenting the designing method of abrasive distribution to design tool with the best abrasive distribution. Through the investigation of the local project, optimal path can be gained, and it can provide a new method to solve the abrasive distribution designing and rotate speed ratio optimization.

固结磨料磨抛具有加工效率高、工件的形状精度以及磨粒运动轨迹可控性好等优点，是基片材料加工的未来发展趋势。磨抛轨迹是磨粒分布与转速比高度耦合的结果，它直接影响着磨抛表面精度和加工效率。以往关于磨抛轨迹的研究主要集中在单颗磨粒，没有考虑大量磨粒与转速比的耦合影响，难以获得最优磨抛轨迹，并且在磨具研制上，都是假设磨粒均匀分布最好，但是，在加工精度等方面未能达到预期的加工效果。因此，项目提出磨料分布与转速比耦合下的固结磨料最优磨抛轨迹研究，主要开展以下三方面工作：1）建立磨粒运动轨迹模型和磨抛轨迹的评价方法，分析磨抛轨迹的基本规律；2）提出磨粒分布提取方法，为具体磨具匹配最佳转速比；3）提出磨粒分布设计方法，为磨具设计提供磨粒分布模型。通过本项目的研究，可以实现固结磨料最优磨抛轨迹，为磨具的磨粒分布设计和转速比优化提供一条新的解决途径。

按计划完成了预定项目研究内容。建立了包容大量磨粒参与的单面研磨抛光轨迹模型。提出了轨迹分布非均匀性系数作为表征轨迹分布特征的量化评价方法。研究了转速比、磨粒位置、磨粒数量和磨粒分布对轨迹分布特征的影响规律。研究了大量磨粒与转速比耦合下的轨迹分布规律及其非均匀性特征，揭示了不同磨粒分布磨盘具有不同的轨迹非均匀性极限和轨迹分布轮廓形态，以及它们对材料去除均匀性和粗糙度分布等的影响规律。建立了适用于实体磨盘的磨粒位置信息提取方法，通过耦合转速比和提取的磨粒位置信息，可以有效地优化出与实体磨盘相匹配的最佳转速比参数，提高研磨抛光加工质量和加工效率。提出了基于基元的磨具设计方法，分析了基元形状和基元大小对轨迹非均匀性的影响规律，设计并制备了比常规图案磨盘轨迹非均匀性更低的优化图案磨盘。本项目研究成果对研磨抛光工具设计和加工参数优化提供了重要的参考价值和技术支持。