基于单晶硅纳米薄膜的柔性微波单片集成电路研究

Being bendable, light weight and many other unique advantages make flexible electronics draw increasing attentions. With the ongoing research, the speed and the performance of the flexible electronic devices have been improved. A series of flexible discrete devices and simple functional circuits have been realized and have been widely used in electronic display, wearable equipment, biomedical applications, etc. However, the existed flexible electronic devices and circuits are still incapable of meeting the needs of high-frequency microwave applications, which makes the research of flexible monolithic microwave integrated circuit (flexible MMIC) essential. Although a variety of flexible microwave discrete devices have been fabricated at present, flexible monolithic microwave integrated circuits cannot be realized due to the lack of theoretical basis, model, design method and process technology. The project will focus on these key issues to research on the flexible single-crystalline silicon monolithic microwave integrated circuits by electronic, mechanical, material multi-discipline methods: optimize the design and manufacturing process; build the accurate models; study the matching methods of flexible microwave circuit; analyze the generation mechanism and control methods of parasitic effects; analyze the key impact of deformation to circuit performance, and achieve a variety of core microwave circuits (such as amplifier). This project will provide an important foundation for expanding the application of flexible electronics in the high-frequency high-speed area.

可弯曲、轻便等独特优势使柔性电子研究越来越受到关注。随着研究深入，柔性电子器件的速度逐步提升、功能完善，多种柔性分立器件及中低频功能电路得以实现，并逐渐应用在电子显示、可穿戴设备、生物医学等领域。然而，目前的柔性电子器件电路仍不能达到高频微波应用的要求，这就使得柔性微波单片集成电路（尤其是硅基电路）的研究必不可少。但由于欠缺针对柔性硅基微波单片集成电路的基础理论、模型、设计方法和制造技术，柔性微波单片集成电路仍无法实现。本项目将针对以上亟待解决的问题从电子学、机械力学、材料学等学科对基于单晶硅纳米薄膜的柔性微波单片集成电路进行研究：创新针对柔性硅纳米薄膜微波电路的制造方法；分析高频寄生效应对柔性微波电路的影响机制和控制方法；研究柔性硅薄膜微波电路匹配的设计方法；分析形变影响电路性能的关键机制。以此为基础设计实现多种柔性硅薄膜微波单片集成电路。本项目将为柔性电子在微波射频领域的应用提供基础。

柔性电子突破传统电子电路的刚性基底应用限制，在诸多领域体现出独特优势，因此受到人们的广泛关注。然而目前针对柔性电子电路的研究与应用仍主要在中低频范围，如柔性电子显示屏、可穿戴设备、射频标签等。而高性能柔性电子器件电路在高频领域的应用需要进一步拓展。本项目针对以上需求开展了基于单晶硅基薄膜的柔性射频微波器件与单片集成电路研究，完成的主要研究内容包括：设计制造了柔性微波晶体管、柔性微波PIN二极管、PIN型光电探测器等多种类型的柔性电子器件。通过实验与建模的方法，针对多种柔性微波电子器件进行性能表征并深入分析柔性器件特有工作机制。构建了针对柔性微波单片集成电路设计的较为准确的元器件模型，以此为基础设计柔性单晶硅薄膜射频低噪声放大器等电路，并对其电路匹配、寄生效应、性能关键影响参数、弯曲态特性等进行分析验证。综合新型半导体材料、陶瓷介质、有机介质等材料设计实现了多种高性能柔性薄膜晶体管器件。对柔性半导体薄膜器件电路的形变态特性进行了表征、建模与机制原因分析。基于高性能新型半导体器件进行拓展探索研究，设计制造了多种用于气体、生物检测的高灵敏度、高选择性半导体薄膜传感器。本项目的研究成果将为高性能、高速柔性电子器件在多领域的应用提供必要的基础。