短距离30GHz/60GHz双频段高速无线通信收发系统片上集成关键技术研究

With the rapid development of communications technology, the amount of data exchange is increasing within the system. To the chip with a large amount of data exchange requirements, the number of internal input/output interface primarily determines the Chip area rather than the chip function core, which is particularly reflected in the high level of integration of large-scale digital systems. .The millimeter-wave short-range high-speed wireless communication system is adopted, and put forward the overall scheme of the low-power dual-band wireless serial transceiver. The transceiver uses Bond-Wire Antennas for both sending and receiving. The chip is fabricated in the silicon substrate CMOS technology, which realizes the date receiving and modulation or demodulation. The millimeter-wave carrier injection locking technique is mainly researched to replace traditional high power phase-locked loop, and the millimeter-wave injection locked frequency divider circuit is studied. Local oscillator signal is extracted from the carrier information. Final the dual-band ultra-high-speed short-range millimeter-wave wireless transceiver communication system chip is fabricated in 65nm standard CMOS process.

随着通信技术的高速发展，系统内部信息的数据传输量不断增加。具有大规模数据量交换需求的芯片面积主要取决于芯片内部输入/输出接口的数量，而不是芯片功能内核，这在高集成度的大规模数字系统中体现的尤为明显。.本课题选择毫米波短距离高速无线通信系统作为切入点，创新性地提出低功耗双频段无线串行收发总体方案，利用收发共用的引线键合天线，采用标准CMOS工艺实现毫米波段数据接收及调制解调。课题重点解决毫米波段的载波注入锁定技术以及毫米波注入锁定式分频器等关键技术，取代传统的大功耗锁相环，在接收端通过提取载波信息获得相干本振信号。课题最终基于65nm 标准CMOS工艺完成双频段超高速短距离毫米波无线收发通信系统的研究与芯片实现。

随着集成电路和通信技术的飞速发展，无线通信技术在人们的生活中日益重要。基于前期的研究成果，创新性的提出了双频段短距离无线串行收发方案。并且对发送端，接收端和基于载波注入技术和一些重要模块都进行了深入的研究。大部分的模块都已经流片验证，并且在报告中对测试结果进行了说明。考虑到成本问题，本项目最终采用90nm工艺替代65nm工艺。对于本次无线通信技术的研究必将促进我国通信技术的发展。