基于Sn-P-F-O基质的低熔点BSSO、SCASN荧光粉掺杂复合材料的制备、测试和封装机理研究

The phosphor converted LED hold huge application in the high power solid state lighting market. High thermo conductivity and stability phosphor composite materials are the key for phosphor converted LED. However, The existing phosphor silicon composite has poor resistance to oxygen, heat and humidity, and the mechanism of packaging influence is not clear, which have become the bottleneck of developing this technology. In this project, a preparation method of low melting point PIG composite based on Sn-P-F-O glass system is proposed. The PIG composite with BSSO and SCASN is prepared by low temperature co-firing method. The application fundamental study of its composition optimization, fabrication, light conversion mechanism, oxygen heat and humidity stability was carried out. The study mainly include: exploring the process factors and laws affecting the performance of materials, revealing the mechanism and path of light energy generation, transmission and dissipation in the coexistence system of LED chip, phosphor and glass matrix, and clarifying the ratio of phosphor blending and glass matrix formulation. Based on the mechanism of PIG-LED packaging optical performance, a collaborative optimization design method based on multi-factor (material, process, package) PIG composite was established. It provides guidance for the preparation and packaging of PIG composites with high luminous efficiency, high index and oxygen thermal humidity stability, and lays a theoretical and technical foundation for the industrial realization of high performance PIG composites.

荧光粉转换型LED在高功率灯具市场中占有不可或缺的重要地位，高效率高稳定的荧光粉复合材料则是其中的核心支撑材料。然而，现有的荧光粉硅胶复合材料抗氧热湿稳定性差，封装影响机理不明确成为制约该项技术推广应用的主要瓶颈。本项目提出了一种基于Sn-P-F-O玻璃体系的低熔点PIG复合材料的制备方法,通过低温共烧法制备得到BSSO和SCASN复合的PIG。进行其配方优化、制备工艺、光转换机理、氧热湿稳定性的应用研究。主要包括：探究影响材料性能的工艺因素及规律，揭示LED芯片、荧光粉、玻璃基质三者共存体系中光能量产生、传输与耗散的机理与途径，阐明荧光粉共掺比例、玻璃基质配方对PIG-LED封装光学性能的作用机理，建立基于多因素（材料、工艺、封装）的PIG复合材料协同优化设计方法。为高光效、高显指、氧热湿稳定性PIG复合材料制备及封装提供指导，为高性能PIG复合材料的产业化实现奠定理论和技术基础。

Sn-P-F-O基PIG有望成为一种低成本高性能的新型光转换复合材料，可用于激光二极管和光电器件的封装，具备高热导率高可靠性优势。本项目利用低温无压烧结方法制备得到了BSSO和SCASN复合PIG，进行了PIG配方优化、制备工艺、光转换机理的应用研究。深入探究了影响PIG性能的工艺因素及规律，揭示了LED芯片、荧光粉、玻璃基质三者共存体系中光能量产生、传输与耗散的机理与途径，阐明了荧光粉共掺比例、玻璃基质配方对PIG-LED封装光学性能的作用机理，建立了基于多因素（材料、工艺、封装）的PIG复合材料协同优化设计方法。为低成本、高光效、高显指、氧热湿稳定性PIG复合材料制备及封装提供了有效的理论和实践指导。本课题的相关研究为推进我国高性能PIG复合材料的产业化提供了重要的理论指导和技术支撑。