表面安装集成电路引线三维尺寸在线测试方法的研究

This project presents a real-time laser scanning method for the three dimensions of the SMIC (Surface Mounting Integrated Circuit) leads. The mathematic model of this measurement system is introduced, and the calibration method for the system parameters is detailed. The project investigates the coplanarity evaluation method whose reference plane is the contacted plane. According to the researches, the novel technique for the resolution and synthesis of the optical images is presented, which increases the resolution power of the measurement system. The capacitance sensor compensates the dynamic error of the measurement system in the real-time scanning process. The experiments are carried out, in which BGA (Ball Grid Array) chips are the measured objects. The experimental results demonstrate that the measuring error is

研究线结构光三维测试技术、光学图像的拆分与合成技术、分立点三维图像实时代集和处理技术及动态误差实时修正方法，实现SMIC引线三维尺寸在线测试。该方法新、分辨力高，柔性大，测试速度快，实用性强。将有效解决SMIC引线三维尺寸在线测试难题，并可在焊接电路板焊点等分立点在线三维测试方面应用。有很强的理论意义和实用价值。