空间辐射下高精度高效SOI-CMOS星像感知系统单片集成技术研究

As the future space engineering expands in the area of high-orbit and deep space, the star image sensing system, which is the key payload of spacecraft stellar guidance, should both ensure the high-accuracy optical information acquirement in severe space radiation environment and implement the sustainable miniaturization and high-efficiency operation. However, the multi-chip module in current star image sensing system cannot integrate in the same manufacture technology and collaborate in the same handling function, which make it fail to adapt to aforementioned application demand. This project will research the device structure, fabrication process and harden method of double-wafer PPD 4T-APS pixel based on SOI-CMOS process technology and investigate the star image "Sensing- Recognition" collaborative processing circuit oriented the self-feature of star image sensing. It can master the key technology in the multiple dimensions such as the pixel device modeling, process simulation, algorithm design and hardware implementation and achieve the monolithic integration of multitask such as high- accuracy star image photoelectric sensing, radiation-hardened signal readout processing and high-efficiency star centroiding, which can break through the inherent bottleneck of the traditional system. The research production can provide the theoretical direction and technical support to the next-generation high efficiency miniaturized spacecraft payload and have important scientific significance on the promotion of integration density and source utilization ratio of future spacecraft.

随着未来航天工程向高轨、深空领域的不断拓展，星像感知系统作为航天器天文导航的关键载荷既要确保在恶劣的空间辐射环境下完成高精度的星体光信息感知任务，又要持续实现整机轻小化和运行高效化。然而，现有星像感知系统各模块芯片在制造工艺上互不兼容，在处理功能上互不协同，已无法适应上述应用要求。本项目以SOI-CMOS工艺为基础研究双衬底型钳位二极管四管有源像素的器件结构、工艺流程和加固方法，面向星像感知任务自身特点研究星像"传感-认知"协同处理的电路架构和设计方法，在像素器件建模、工艺仿真、算法设计、电路实现等多个维度完成关键技术的突破，克服现有多芯片系统架构的固有缺陷，实现高精度星像光电传感、高抗辐射性信号读出处理、高效化星点认知等多任务的单片集成。项目研究成果可为未来轻小型、高效化航天器载荷提供理论指导和技术支撑，对提高航天载荷的集成度和资源利用效率具有重要的科学意义。

本项目以SOI-CMOS 工艺为基础研究双衬底型钳位二极管四管有源像素的器件结构、工艺流程和加固方法，面向星像感知任务自身特点研究星像“传感-认知”协同处理的电路架构和设计方法,以期解决现有星像感知系统各模块芯片在制造工艺上互不兼容，在处理功能上互不协同的问题。. 本项目主要研究内容包括Handle Wafer光电二极管及其光通路结构的机理分析和物理建模、前道工艺流程差异条件下的像素电子传输结构设计方法、新结构像素不同偏置条件下的Gamma总剂量影响机理、面向感知功能集成的低面积占用低功耗列级ADC设计方法等四部分. . 本项目主要研究成果包括.（1）发现SOI结构像素存在白点簇团和列固定模式噪声现象，其主要归因于像素内晶体管在SOI衬底高金属玷污下产生的热载流子雪崩效应;.（2）完成了多种工艺结构层对电子传输敏感参数的影响机理分析，设计了新型像素传输门结构.发现新型像素在静态偏置条件下的Gamma总剂量辐射效应要高于动态偏置条件;.（3）完成了可用于感知功能集成的低面积占用低功耗列级ADC设计。. 本项目的研究可为未来单片集成化星象感知系统提供充分的技术支撑。