基于光产酸剂和聚碳酸亚丙酯的临时键合/自动解键合研究

Temporary bonding/debonding is necessary for supporting and transferring thin wafers in three-dimensional integration. However, current temporary bonding/debonding processes require light, electricity, heat, force or chemical soaking applied by special debonding equipment for debonding, which easily lead to complex process, high cost and low reliability. The temporary bonding/automatic debonding based on photoacid generator and poly(propylene carbonate) proposed in this project, can realize automatic debonding without light, voltage, heating, chemical solution and without external force (or with weak force applied). Further, it does not need special debonding equipment. Besides，based on in-depth study of high precision fabrication mechanism and decomposition characteristics of temporary bonding structure, the temporary bonding and debonding method can adjust the automatic debonding time, reduce the debonding time of effective debonding and support wafer thinning and backside process by optimization of material ratio, bonding structure characteristics and process parameters according to the actual demand of three-dimensional integration process.

临时键合/解键合是解决三维集成中薄晶圆支撑和传输问题的必要手段。然而，传统的临时键合/解键合工艺在解键合过程中需要施加光、电、热、外力或化学浸泡等条件并且需要使用专用解键合设备，容易造成工艺复杂、成本高以及可靠性低。本项目拟开展的基于光产酸剂和聚碳酸亚丙酯的临时键合/自动解键合研究，在无需光照、电压、加热，无外力或微弱外力作用，无需化学溶液浸泡，无需专用解键合设备的条件下，即可实现自动解键合。此外，基于对临时键合结构高精度加工原理以及分解特性的深入研究，该方法能够根据不同三维集成工艺的实际需求，通过调整材料配比、键合结构和优化工艺参数等手段，实现自动解键合时间可控，从而缩短有效解键合时间，并支撑晶圆减薄以及薄晶圆背部工艺。本项目将为实现高可靠性、工艺简单、低成本的薄晶圆分离奠定重要的理论和技术基础。

临时键合/解键合是三维集成电路的关键工艺技术。然而，传统的临时键合/解键合工艺在解键合过程中需要施加光、电、热、外力或化学浸泡等条件并且需要使用专用解键合设备，容易造成工艺复杂、成本高以及可靠性低。本项目以基于polypropylene carbonate (PPC) 的临时键合/解键合过程为切入点，研发简单、低成本的临时键合工艺，涉及到基于键合工艺的创新性结构以及工艺可靠性研究。本项目还涉及到面向三维集成的键合堆叠TSV结构可靠性分析。