基片集成波导型微波散射式无线无源超高温温度-压力集成传感器基础研究

Based on the demands of real-time and in-situ measurement of temperature and pressure parameters under harsh environments including ultra-high temperature, high speed rotation and metal-rich environment in the fields like aviation, aerospace and weapon equipment etc, here a substrate integrated waveguide based sensitive element/antenna integrated sensor structure using microwave backscattering sensing mechanism is originally put forward, which can realize the measurement of temperature and pressure simultaneously above 1000 ℃ by passive telemetry. Via the study on the related theory about the signal coupling mechanism between the sensitive element and the antenna along with simulation in softwares such as HFSS and ADS etc, the integrated sensitive element/antenna structure model and the interrogation antenna model are to be built. Via the investigation of the mechanical and electrical characteristics of the high-temperature resistant materials, the theoretical basis will be built for the design, fabrication and temperature compensation of the sensor. By combing the ceramic gel casting with metal-sputtering technology, emphasizing on solving the problems of sintering, sealing and stress matching during the fabrication, a set of integration and fabrication methods for the microwave backscattering based high temperature devices will be established. By in-depth study on the clutter-filtering algorithm like T-D gate etc, the interference of environmental noise on the extraction of the sensor signal can be effectively reduced. Eventually, the prototype of the sensitive element/antenna integrated sensor, the interrogation antenna and the measurement system will be developed, providing new look for the measurement of temperature/pressure in harsh ultra-high temperature environments.

针对航空、航天及武器装备中超高温、高旋和多金属等恶劣环境下对温度/压力双参数的实时原位测试需求，本项目基于微波散射测量原理创新性地提出了一种基片集成波导结构的敏感元/天线集成一体化新型传感器，通过无源遥测读取传感器信号，实现1000℃以上压力和温度参数的同时测量。通过研究敏感元与天线之间信号耦合机理等相关理论，结合HFSS、ADS等软件仿真，建立敏感元/天线一体化结构模型与询问天线结构模型，探明耐高温陶瓷材料力学、电学特性，为传感器的设计、制造及温度补偿提供理论基础；通过凝胶注模成型与金属溅射工艺结合，重点解决制造过程中的烧结、密封和应力匹配问题，形成一套微波散射式高温传感器件的集成制造方法；通过深入研究时域门等杂波信号过滤算法，有效降低环境噪声对传感器特征信号提取的干扰。最终研制出敏感元/天线一体化传感器、询问天线及测试系统原型，为超高温恶劣环境下的温度-压力测量提供新思路。

针对航空、航天及武器装备中超高温、高旋和多金属等恶劣环境下对复合参数的实时原位测试需求，为突破现有测试技术手段的不足，本项目对耐高温陶瓷的微型无源敏感器件的理论和实验进行了深入研究。通过HTCC微组装工艺技术及薄膜集成工艺技术，突破了陶瓷基微器件集成制造和高温烧结工艺，提高了各类结构的耐高温工作极限，形成了成套的集成制造工艺规范。提出了基于CSRR结构的多参数无源敏感SIW集成结构，为器件的小型化提供了解决思路。研究了高温环境下温度对其他参数测量的影响机制，提出了传感器的温度补偿算法。进一步利用锁相环、功分器、定向耦合器、衰减器、鉴相器、MCU等电路元件实现了信号调制与解调电路模块的设计，能在0~3GHz范围内对微波传感器件的特征信号进行提取。基于陶瓷基片材料的力-热耦合机理及力-热-电耦合机理，建立了电磁谐振耦合解算模型，为高温恶劣环境下的多参数原位获取提供了解决思路和方案。最终研制了1200℃高温下温度参数以及1000℃高温下压力参数的无源测试器件、1000℃度温/压集成器件及300℃温/压/湿三参数集成器件，突破了各器件参数的测试范围及灵敏度，为恶劣环境下多参数测试提供了参考理论和方法。