基于单目视觉多色结构光源的表面三维形貌快速恢复理论与方法

It is very important to recover the surface three-dimensional topography of solder joint based on two-dimensional image because it can help to evaluate objectively the viewable solder joint quality of printed circuited boards during the electronic assembly process and ensure the quality of electronic product. Extracting the surface three-dimensional information of solder joints from a color image, which acquired from only a camera and a multi-color structure illumination, can be used to recover the surface three-dimensional topography of viewable solder joints quickly. It can overcome multiple solutions and slow convergence problems of traditional SFS methods which recover surface topography of inspected object from shading, and the stereo matching problem of methods which recover surface topography of inspected object based on multi-images. The application will firstly research on the design method of multi-color structure illumination and design a new structure illumination. Secondly, information mapping model is built to describe the relationship among structure parameters of the new illumination, the being-for inspection topography and the acquired color image, and the fast recovery theory and methods of surface three-dimensional topography are proposed based on color image acquired from monocular vision and multi-color structure illumination. Thirdly, the experimental platform of fast recovery surface three-dimensional topography of solder joints is built.Which all are helpful to cope with problems arising from on-line inspecting the surface three-dimensional quality information of solder joints with high speed and high reliablity in the high speed electronic assembly process. Research results of the application can be used to the surface quality on-line insepction of electronic devices, solder printing, devices' assembly in the electronic manufacturing and assembly process and the surface three-dimensional topography on-line inspection of other micro-devices, which to promote the three-dimensional topography on-line inspection levels of our country's high speed manufacturing and assembly process has important theoretical significance and application value.

基于二维图像恢复焊点表面三维形貌对客观评价电子组装过程印刷电路板可视焊点的焊接质量、确保电子产品的品质具有重要意义。基于单目视觉多色结构光源的单幅彩色图像提取焊点表面三维信息可实现可视焊点表面三维形貌的快速恢复，克服传统SFS法反向恢复表面形貌时解的多样性、慢收敛性问题和基于多幅图像恢复三维形貌的立体匹配问题。申请项目拟研究多色结构光源的设计方法，设计新型结构光源；建立光源结构参数、待测表面形貌、彩色图像之间的信息映射模型，提出基于单目视觉多色结构光源的表面三维形貌快速恢复理论和方法，建立焊点表面三维形貌快速恢复软硬件实验平台；解决高速电子组装过程焊点表面三维质量的高速高可靠性在线检测问题。研究成果适用于电子制造和组装过程的电子元器件、焊锡印刷、器件贴装等的表面质量在线检测以及其它微器件的表面三维形貌在线检测，对提升我国高速制造和组装过程的三维形貌在线检测水平具有重要的理论意义和应用价值。

基于二维图像恢复焊点表面三维形貌对客观评价电子组装过程印刷电路板可视焊点的焊接质量、确保电子产品的品质具有重要意义。基于单目视觉多色结构光源的单幅彩色图像提取焊点表面三维信息可实现可视焊点表面三维形貌的快速恢复，克服传统SFS法反向恢复表面形貌时解的多样性、慢收敛性问题和基于多幅图像恢复三维形貌的立体匹配问题。申请项目研究了多色结构光源的设计方法，设计了新型结构光源；建立光源结构参数、待测表面形貌、彩色图像之间的信息映射模型，提出基于单目视觉多色结构光源的表面三维形貌快速恢复理论和方法，建立焊点表面三维形貌快速恢复软硬件实验平台；解决高速电子组装过程焊点表面三维质量的高速高可靠性在线检测问题。研究成果适用于电子制造和组装过程的电子元器件、焊锡印刷、器件贴装等的表面质量在线检测以及其它微器件的表面三维形貌在线检测，对提升我国高速制造和组装过程的三维形貌在线检测水平具有重要的理论意义和应用价值。