大面积多层异构集成化柔性电子器件聚焦超声温控式微转印方法及机理研究

The quality and efficiency as well as the controllability of micro-transfer printing are the key factors restricting the performance of the large area multilayer heterogeneous integrated flexible electronic devices and also the problems to be solved in the manufacturing process. According to the urgent demand of breaking through the bottleneck of manufacturing technology of the large area multilayer heterogeneous integrated manufacturing of flexible electronic device in our country, a realizing method of the shape memory behavior of focused ultrasound temperature controlling stamp is proposed, the heat transfer model of shape memory polymer (SMP) stamp under focused ultrasound field is established and then the comprehensive matching design method of focused ultrasound system and SMP stamp has been investigated. The deformation recovery mechanism of SMP stamp is explored by the experiment, the theoretical model of controllable adhesion force of SMP stamp is established, the mapping relationship between geometric property of surface microstructure and adhesion force was investigated and then the micro-transfer printing mechanism also is revealed. Aim at typical micro-transfer printing process of flexible electronic device, the study of basic process experiment is carried out, the influence rule about micro-transfer printing quality and efficiency of the key process parameters are revealed, process optimization model is establish and then the process parameters optimization of micro-transfer printing is accomplished. The study can provide the supports of theory and key technologies for a further development of high quality and high efficiency controlled micro-transfer printing methods and technologies.

微转印的质量和效率以及可控性是制约大面积多层异构集成化柔性电子器件性能的关键因素，亦是其制造过程中亟待解决的难题。本项目密切结合我国对于突破大面积多层异构集成化柔性电子器件制造技术瓶颈的迫切要求，提出聚焦超声温控印章形状记忆行为的方法，建立聚焦声场下形状记忆聚合物（Shape memory polymer，SMP）印章的传热模型，研究聚焦超声系统和SMP印章的综合匹配设计方法；实验探寻SMP印章的形变回复机制，建立SMP印章可控黏附力理论模型，全面考察印章表面微结构几何属性同黏附力的映射关系，揭示可控黏附机理；开展柔性电子器件典型微转印过程基础工艺实验研究，揭示关键工艺参数对微转印质量和效率的影响规律，建立工艺优化模型并实现微转印工艺的参数优化。研究成果可为柔性电子器件高质高效可控微转印方法和技术的进一步发展和应用提供理论和关键技术支持。

微转印的质量和效率以及可控性是制约大面积多层异构集成化柔性电子器件性能的关键因素，亦是其制造过程中亟待解决的难题。本项目密切结合我国对于突破大面积多层异构集成化柔性电子器件制造技术瓶颈的迫切要求，提出了聚焦超声温控印章形状记忆行为的方法，建立了聚焦声场下形状记忆聚合物（Shape memory polymer，SMP）印章的传热模型，研究了聚焦超声系统和SMP印章的综合匹配设计方法；实验探寻了SMP印章的形变回复机制，建立了SMP印章可控黏附力理论模型，全面考察了印章表面微结构几何属性同黏附力的映射关系，揭示了可控黏附机理；开展了柔性电子器件典型微转印过程基础工艺实验研究，揭示了关键工艺参数对微转印质量和效率的影响规律，建立了工艺优化模型并实现微转印工艺的参数优化。研究成果可为柔性电子器件高质高效可控微转印方法和技术的进一步发展和应用提供理论和关键技术支持。