Aromatic polyamides are a class of high performance polymer because of their combination of excellent thermal and thermooxidative stabilites, outstanding mechanical and electrical properties, and are widely used in aerospace, electronics and other high technology fields. However, traditional aromatic polyamide materials are currently difficult to fabricate owing to their high fusion temperature and insolubility in organic solvents, which restrict their areas of application. To further meet the needs of microelectronic and optical devices, it has be one of important research areas to design and prepare novel polyamides with low dielectric constant and high optical transparency, combined with advantages such as excellent processing properties, mechanical properties and thermal stabilities. A series of novel fluorinated aromatic polyamides, poly(amide-imide)s containing 9,9-diphenyl-10,10-bis(3-trifluoromethylbenzyl)-9,10-dihydroanthrance moiety, as well as polyamides combined with multi-trifluoromethyl substituents or polybenzoxazole units will be developed from commercially available anthranone and 3-(trifluoromethyl)benzyl chloride as main starting material by the polycondensation reaction of diamines or dicarboxylic acids containing trifluoromethyl and 9,10-dihydroanthrance groups as one of monomers in this study, respectively. The reaction conditions for the preparation of monomers and the corresponding polymers will be investigated and their structures will be charaterized by the measurements such as FTIR and NMR. The influences on the properties of different moieties such as trifluoromethyl and 9,10-dihydroanthrance groups of the resulting polymers will be further studied, and the solubility, crystallinity, thermal stability, and mechanical property as well as optical and dielectric behaviors of these new polymers will also be characterized by TGA, DSC and WAXD, etc. We hope to develop several novel polyamides with a combination of excellent properties such as lower dielectric constant, high optical transparency, better thermal ability and easier processing.
聚芳酰胺是一类高性能高分子,以其优异的热、电和力学性能在宇航、电子、电器等高新技术领域中有着广泛的应用。然而,传统的聚芳酰胺熔融温度高,溶解性差,加工较困难,限制了其进一步应用。近年来,为了进一步满足微电子和光学器件等需求,研制具有低介电常数、高透明性、易加工成型等综合性能优异的新型聚芳酰胺成为该领域重要的研究方向之一。本项目拟以商品化的蒽酮和间三氟甲基苄氯为主要的起始原料,设计合成含三氟甲基和9,10-二氢蒽结构的二胺和二羧酸新单体,继而通过缩聚反应制备含10,10-二(3-三氟甲基苄基)-9,10-二氢蒽结构单元的聚酰胺、聚酯酰胺、聚酰胺-酰亚胺、含多个三氟甲基以及苯并噁唑基团的聚酰胺。拟通过优化单体制备和聚合反应条件,研究对聚合物的结构和性能,探讨三氟甲基和9,10-二氢蒽等基团对聚合物性能的影响,期望能获得一些介电常数低、透明性高、耐热性优良且易加工成型等综合性能优异的新品种。
聚芳酰胺是一类高性能高分子,以其优异的热、电和力学性能在宇航、电子、电器等高新技术领域中有着广泛的应用。然而,传统的聚芳酰胺熔融温度高,溶解性差,加工较困难,限制了其进一步应用。近年来,为了进一步满足微电子和光学器件等需求,研制具有低介电常数、高透明性、易加工成型等综合性能优异的新型聚芳酰胺成为该领域重要的研究方向之一。.本项目以蒽酮、间三氟甲基苄氯、氯化亚砜、苯胺、苯酚、邻甲基苯酚、对氯硝基苯、5-氯-2-硝基三氟甲苯、2-氯-5-硝基吡啶等主要原料,设计并合成了9,9-二(3-三氟甲基苄基)-10,10-二(4-氨基苯基)-9,10-二氢蒽、10,10-二[4-(4-氨基-2-三氟甲基苯氧基)苯基]-9(10H)-蒽酮、10,10-二[4-(4-氨基-3-吡啶氧基)苯基]-9(10H)-蒽酮、10,10-二[4-(4-氨基苯氧基)苯基]-9(10H)-蒽酮、10,10-二[4-(4-氨基苯氧基)-3-甲基苯基]-9(10H)-蒽酮 等二胺单体,继而通过缩聚反应制备含10,10-二(3-三氟甲基苄基)-9,10-二氢蒽结构单元的聚酰胺,以及含蒽酮和三氟甲基,蒽酮和吡啶结构的聚酰胺和聚酰亚胺等一系列新型聚合物。此外,课题组详细优化了单体制备和聚合反应条件,考察了聚合物的结构和性能关系,探讨三氟甲基和蒽酮等基团对聚合物性能的影响,获得了一些介电常数低、透明性高、耐热性优良且易加工成型等综合性能优异的新品种,并为其潜在应用积累了一定的实验依据和理论基础。
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数据更新时间:2023-05-31
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