光成像型阻焊油墨的研究

Currently used photo-imaging solder resist suffers from premature curing during the heating up process to remove the solvent which is used for ease of application.This premature curing is due to the reaction between the carboxylic acid group of the resin and the epoxide as well as the thermal polymerization of the epoxide.In order to avoid this premature curing, the kinetic of the esterification reaction by using different carboxylic acids was thoroughly investigated. The catalyst and the kind of carboxylic acid play an important role in the reaction. The preferred carboxylic acids and their combination were found. A cationic photoinitiator was used in place of the latent thermal initiator to avoid thermal polymerization of the epoxide proved to be effective.

光成像型阻焊油墨是制造高密度印刷电路板的重要材料。油墨组成中主体树脂的侧羧基与环氧树脂在预热时的早期固化是关键难点，涉及树脂合成中催化剂的作用和羧基与环氧树脂的酯化反应等基本问题。本项目从该基本问题入手，研究各种催化剂及多元酸酐的作用，并以阳离子光引发剂取代潜伏性热固化剂解决此难点，研究成果将为该材料的研制提供理论依据。