非均质微互连材料损伤和失效的多尺度研究

In this proposal, the heterogeneous micro-interconnect materials will be investigated. The theoretical, experimental and numerical analysis framework of multi-scale research will be established, in order to identify the material properties as well as simulate the damage and failure of heterogeneous micro-interconnect. The advanced research tools (e.g.,the scanning electron microscopy, X-ray synchrotron radiation and so on) will be used for studying the construction method of representative volume element which are used to characterize the meso-scale model; Based on the extended finite element method and cohesive zone model, a meso-scale and macro-scale fully coupled multiscale damage and failure simulation method which can be used to simulate the initiation and propagation of multi-crack will be developed; Based on macro-scale experiments in combination with the digital image correlation technique, multi-scale simulation and inverse analysis, a meso-scale parameter identification method of heterogeneous material will be established, together with micro-scale molecular dynamics simulation, as well as macro-scale related methods, to study the heterogeneous material properties of the micro-interconnect, finally to obtain the accurate heterogeneous material information and evaluate the applicability of different scale methods; Ultimately, the failure mechanisms of the heterogeneous micro-interconnect during impact fracture and fatigue failure will be studied by utilzing the above research achievements, so as to provide a guideline for reliability evaluation, failure prediction and optimized design of micro-interconnect materials and structures. These achievements can also be used for multi-scale damage and failure analysis of the other heterogeneous materials.

本项目以芯片封装中非均质微互连材料为研究对象，建立材料模型参数的多尺度表征、以及损伤与破坏的多尺度模拟的理论、实验与数值分析框架。利用先进的测试手段（如：X射线同步辐射等）研究细观尺度代表性体积单元的自动化构造；基于扩展有限元法和内聚力模型，发展一套能考虑多裂纹萌生与扩展的、细观和宏观尺度上完全耦合的多尺度损伤与失效的模拟方法；基于宏观实验结合数字图像相关技术、多尺度模拟和反演分析等手段，建立一套非均质材料细观参数的反演辨识方法，与微观尺度上的分子动力学模拟，以及宏观尺度的表征方法一起研究非均质微互连材料的模型参数，从而更准确地获知非均质材料的力学特性，并对不同尺度方法的适用性进行合理地评价；最后利用上述成果来研究非均质微互连结构在冲击断裂和疲劳破坏中的失效机理，为非均质微互连结构的可靠性评价、失效预测以及材料结构的优化设计提供依据。该项目的研究成果也可用于其他非均质材料的多尺度分析。

本项目主要以芯片封装中非均质材料为研究对象，建立了材料模型参数的表征、以及损伤与破坏的多尺度模拟的理论、实验与数值分析框架。利用先进的测试手段研究了细观尺度代表性体积单元的自动化构造方法；基于扩展有限元法和内聚力模型，发展了一套能考虑多裂纹萌生与扩展的、细观和宏观尺度上完全耦合的多尺度损伤与失效的模拟方法；为了适应项目的需求，自主开发了一套微型疲劳试验机以及一套数字图像相关的光测系统；基于宏观实验结合数字图像相关技术、多尺度模拟和反演分析等手段，建立了一套非均质材料参数的反演辨识方法，与微观尺度上的分子动力学模拟，以及宏观尺度的表征方法一起研究了非均质微互连材料的模型参数，从而更准确地获知非均质材料及其界面的力学特性，并对不同尺度方法的适用性进行了合理地评价；最后利用上述成果来研究了非均质微互连结构在冲击断裂和疲劳破坏中的失效机理，为非均质微互连结构的可靠性评价、失效预测以及材料结构的优化设计提供依据。该项目的研究成果也可用于其他非均质材料的多尺度分析。