The abrasive wear mechanism of grinding wheel and its effect on the grinding surface forming mechanism in grinding process of large diameter SiC ceramic mirror are one of the important basic scientific problems in the field of precision machining. The existing research mainly analyzes the wear phenomenon of abrasive wear, the removal of brittle-plastic transition condition. While there remains the lack of abrasive wear-related mechanism and the effect of wear on material removal and surface formation. Simulation and experiment researches of single-abrasive scratching and multi-abrasive coupled scratching are conducted and the tribological theory is introduced to analyze the fraction between grit and SiC ceramics. The wear characteristics of the abrasive and the dynamic mechanical behavior of the abrasive are investigated, the interaction between the abrasive grains influenced by the multi-abrasive coupling effect is analyzed. The wear process and wear mechanism of abrasive grains are studied. The broken process of the scratched surface under the influence of multi-abrasive coupled wore of diamond grains is revealed. The formation and evolution mechanism of surface damage influenced by abrasive wear process is revealed and the optimization process strategy is put forward with the purpose to reduce abrasive wear and SiC ceramic surface damage. The research results provide theoretical and experimental basis for high efficiency and high quality machining of large diameter SiC ceramic reflector, which has important theoretical significance and application value.
大口径SiC陶瓷反射镜磨削加工过程中的砂轮磨粒磨损机制及其对磨削表面形成机制的影响是精密加工领域重要基础性科学问题之一。现有研究主要从实验的角度分析了磨粒磨损钝化现象、材料去除脆塑转变条件等,缺乏磨粒磨损相关机理性研究以及磨损对材料去除和表面形成的影响的相关分析。本项目通过SiC陶瓷单颗金刚石磨粒刻划和多磨粒耦合刻划仿真及实验研究,引入摩擦学理论,探索刻划过程中磨粒-工件摩擦磨损规律及动态力学行为特性、多磨粒交互影响作用机制、多磨粒耦合作用下金刚石磨粒磨损过程及演变机制、多磨粒耦合磨损影响下划痕表面损伤累积过程,揭示基于多磨粒耦合刻划的SiC陶瓷磨削磨粒磨损特性及其影响下的表面损伤形成和演变机制,提出减少磨粒磨损及SiC陶瓷表面损伤的优化工艺策略。该研究成果为大口径SiC陶瓷反射镜高效高质量加工提供理论和实验依据,具有重要的理论指导意义与应用价值。
大口径SiC陶瓷光学镜面磨削加工砂轮磨粒磨损机制及其对磨削表面形成机制的影响是精密加工领域重要基础性科学问题之一,本项目针对这种问题,通过单磨粒和多磨粒刻划仿真和实验分析了SiC陶瓷材料去除过程中材料去除形式、表面形成机制、亚表面损伤形成机理、磨粒磨损钝化机制以及材料去除脆塑转变等。首先,通过SiC陶瓷单颗金刚石磨粒刻划仿真及实验研究,分析了刻划过程中磨粒-工件动态力学行为特性、材料破损及去除机制、磨粒磨损情况及预测,以及刻划参数对它们的影响规律;进而,提出了多磨粒交互刻划模型,通过仿真及实验研究了多磨粒交互影响作用机制、多磨粒耦合作用下金刚石磨粒磨损过程及演变机制、多磨粒耦合磨损影响下划痕表面损伤累积过程,揭示基于多磨粒耦合刻划特性及其在刻划参数影响下变化规律。本项目的研究成果为大口径SiC陶瓷镜面高效高质量加工提供理论和实验依据,具有一定的的理论指导意义与应用价值。
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数据更新时间:2023-05-31
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