新型层状结构陶瓷的制备与应用基础

To meet the application requirements of structure and function integration and formation of complex components, this project aims at solving three key scientific probloms: structural design, additive manufacturing technologies and interfacial mechanisms of new multielement laminated ceramics, and manufacturing process mechanisms, structral coupling mechanisms, structure and performance responses and structure/performance matching design of laminated cramics will be investigated. The research objectives are revealling the chemical reaction and growth mechanism of the laminated ceramics, establishing the mechanical models of the laminated ceramics, obtaining the responding laws and mechanisms between structure and strength, Young’s modulus, fracture toughness, dielectric properties, thermal properties as well as environmental properties, and verifying structure/performance matching design of the laminated ceramics, and optimizing the structure design and manufacturing technologies. The reseach results will be used to solve the three difficult problems: collaborative manufacturing of the laminated ceramics, regulation and control of interfacial stresses and collaboration between structure and function, which would promote the manufacture and application of the laminated ceramics as laminated thermal structural ceramics (L-TSC), laminated high thermal conductivity structure ceramics (L-TSC), laminated wave transmitting structure ceramics (L-WTC), laminated impact resistance structure ceramics (L-IRC), and laminated ultra-high temperature structure ceramics.

本项目针对新型多元层状陶瓷结构功能一体化及其复杂构件成型的应用需求，围绕层状陶瓷材料结构设计、层状陶瓷增材制造方法、层状陶瓷界面作用机理三个科学问题，开展层状陶瓷制造过程机理、层状陶瓷结构耦合作用机理、层状陶瓷结构与性能响应以及层状陶瓷结构/性能匹配设计及验证研究。揭示层状陶瓷增材制造的反应和生长机理；建立层状陶瓷应力理论模型；获得层状陶瓷的结构与强度、模量、断裂韧性、介电、热学以及环境性能的响应规律及机理；验证层状陶瓷结构/性能的匹配设计，并优化结构设计和制备工艺。研究成果将解决层状陶瓷组元协同制造、层状陶瓷界面应力调控和层状陶瓷结构与功能协同三个难题，促进层状热结构陶瓷(L-TSC)、层状高导热结构陶瓷(L-TCC)、层状透波结构陶瓷(L-WTC)、层状耐冲击结构陶瓷(L-IRC)、层状超高温结构陶瓷(L-UHTC)的制备与应用。

本项目针对新型多元层状陶瓷结构功能一体化及其复杂构件成型的应用需求，围绕层状陶瓷材料结构设计、层状陶瓷增材制造方法、层状陶瓷界面作用机理三个科学问题，开展层状陶瓷制造过程机理、层状陶瓷结构耦合作用机理、层状陶瓷结构与性能响应，以及层状陶瓷结构/性能匹配设计及验证研究。针对层状陶瓷的制造过程，本项目分别研究了界面对CVI沉积SiC基体的影响及机理以及TP-HPS制备Si3N4/ZrO-Zr2CN层状陶瓷的热压反应机理。对于层状陶瓷的结构作用，分别从层内、层间以及层内层间耦合三个角度，通过实验与计算相结合，建立了相对应的理论模型，揭示层状陶瓷结构耦合作用机理。针对层状陶瓷结构与性能的响应问题，本项目围绕分别层状SiCw/SiC陶瓷、层状Si3N4w/Si3N4陶瓷、层状ZrO-Zr2CN/Si3N4陶瓷、层状HfC(HfB2)-SiC超高温陶瓷与层状金刚石-SiC高导热结构陶瓷五个体系，系统地研究层结构和界面层对材料强度、模量、断裂韧性、介电、热学以及环境性能的影响，并分析层结构和界面层的协同作用机理。最后通过对层状陶瓷结构耦合作用机理以及层状陶瓷结构与性能响应研究，获得层状陶瓷结构/性能的相关性。研究成果解决了层状陶瓷组元协同制造、层状陶瓷界面应力调控和层状陶瓷结构与功能协同三个难题，促进层状热结构陶瓷(L-TSC)、层状耐冲击结构陶瓷(L-IRC)、层状超高温结构陶瓷(L-UHTC)和层状高导热结构陶瓷(L-TCC)的制备与应用。