基于功能集成的磁封装基础理论和关键技术研究

Power electronics converters have been widely used in various systems to supply power. Their power density has a direct impact on the volume and weight of systems. The constant development of semiconductor technology has dramatically reduced the volume of active devices. However, there’s no such a big progress in the field of passive devices which take more than half volume of the whole converter. In order to increase power density of the whole converter, it is proposed in this project that integrating the magnetics whose function is energy conversion and the package whose function is protection in one physical component—magnetic package. In the project, the design model of the inductor is deeply explored and methods of optimization will be advanced. Coupling in the magnetic packaged converter, which causes the parasitic inductance and magnetic coupling of different magnetic components, is analyzed, and corresponding solutions will be proposed. Based on the loss model and thermal model of the converter, temperature distribution and internal mechanical strength on components are analyzed. The methods to adjust the strength are also proposed. Finally, verify that the magnetic packaged converter has better electrical and thermal performance, higher power density than the conventional plastic packaged converter.

电力电子变换器作为供电电源被广泛的应用在各类系统中，其集成度直接决定着整个系统的体积和重量。半导体技术的不断进步使得有源元件的体积已经大幅减小，但是无源元件技术长期以来却没有显著的进步，无源元件占据了整个变换器的大部分体积。为了进一步提高变换器的功率密度，本项目提出将磁件的电能变换功能与封装的保护功能通过一个物理实体—磁封装来实现。项目将对磁封装中电感设计模型进行深入的研究，并将提出优化电感的解决方案；分析磁封装变换器内部磁耦合导致的线路寄生电感与多磁件之间的耦合，并提出具体的解决办法；在建立磁封装变换器损耗模型与热模型的基础上，对变换器的温度分布及内部元器件所受应力进行分析，并提出调节该应力的相应方式。最终评估磁封装变换器相对于传统的塑封变换器在电性能、热性能和功率密度方面的优势。

电力电子变换器作为供电电源被广泛的应用在各类系统中，其集成度直接决定着整个系统的体积和重量。半导体技术的不断进步使得有源元件的体积已经大幅减小，但是无源元件及有源元件技术长期以来却没有显著的进步，其中无源元件占据了整个变换器大部分体积。为了进一步提高变换器的功率密度，本项目将研究多功能集成磁件元件，该元件包括了有源集成和无源集成。对于无源集成，主要分析其提出的电感绕组的损耗分析及热性能和电感中的寄生参数的影响。对于有源集成， 氮化镓器件是有源集成的理想器件。但是氮化镓器件对寄生参数十分敏感和在死区时间内存在反向导电的不稳定性问题。针对这些问题，提出了解决方案。最后，在有源和无源集成方式的基础上成功设计了集有源元件和无源元件的功能集成电源模块。