图形化金属纳米转印机理及方法研究

Novel functional materials and devices based on metal nano-structure (points, lines, patterns) can be widely used in various emerging industries such as flat panel display, new energy, and sensors etc. At present, for conventional nanofabrication technology (electron beam lithography, self-assembly, interference lithography), there exist many shortcomings such as complex process, poor controllability, inability to realize large-size. Micro-contact printing (uCP) provides a new means for nanofabrication of metal nano-structure, which has not been researched for specific process parameters and structural tolerance of this process. Based on nano-metal polarization devices, the transfer mechanism of the nano-metal layer between the receptor and receiver material will be studied in detail. The relationship between nanostructure and the thickness of metal layer will be researched. Based on it, a novel transfer process will be explored, which will be helpful to establish a tolerance of process parameters of metal nano-transfer printing method for metal engineering of the functional devices.

基于纳米金属结构(点、线、图形)的新功能材料及器件可广泛应用于平板显示、新能源、传感器等新兴产业领域。目前，传统微纳加工工艺（电子束光刻、自组装、干涉光刻等）存在工艺复杂、可控性差、无法实现大尺寸等缺点。 微接触印刷(uCP, Micro-Contact printing)也称为转印为金属微纳结构制造提供了一种新的技术手段，目前国内外尚未对具体工艺参数及结构容差方面做深入研究，本项目以纳米金属偏振器件为例，研究金属纳米转印技术中被转印金属层分别与转印载体、转印受体各材料之间相互作用的机理，研究纳米图形化结构形貌与金属层转印厚度的关系，并在现有转印技术方法的基础上，探索新的纳米转印方法，最终建立一套对工艺参数容差大的金属纳米转印方法，为金属功能器件的工程化制造奠定基础。

基于纳米金属结构(点、线、图形)的新功能材料及器件可广泛应用于平板显示、新能源、传感器等新兴产业领域。目前，传统微纳加工工艺（电子束光刻、自组装、干涉光刻等）存在工艺复杂、可控性差、无法实现大尺寸等缺点。 微接触印刷(uCP, Micro-Contact printing)也称为转印为金属微纳结构制造提供了一种新的技术手段，目前国内外尚未对具体工艺参数及结构容差方面做深入研究，本项目以柔性电子器件为例，研究2种金属纳米转印的工艺方法，重点基于微纳光刻技术实现器件图形化，分别通过金属镀膜以及金属生长工艺获得金属化微纳结构，分别适用用不同衬底器件的制备。研究纳米图形化结构形貌与金属层转印厚度的关系，并在现有转印技术方法的基础上，最终建立一套对工艺参数容差大的金属纳米转印方法，为金属功能器件的工程化制造奠定基础。