极端环境下高功率半导体激光器可靠性与失效机理研究

In recent years, high power semiconductor lasers have achieved widely applications in the fields of material processing, aerospace, national defense, etc. The high power semiconductor lasers with higher reliability in the extreme environments are required. When high power semiconductor lasers operate in the extreme environments, some phenomena, such as fatigue failure, power decrease, spectrum broadening, reliability decrease, will occur. In this project, the reliability and failure mechanisms of high-power semiconductor lasers under the extreme environments will be studied, including higher temperature, lower temperature, thermal cycling, high humidity, high mechanical shock, high vibration,radioation. .1) The experiment platform and computational analysis model will be built and the thermal cycling and electrical pulses fatigue failure mechanisms of the connection material will be studied. 2) Study the phenomena of intermetallic compounds (IMC), electromigration and electro-thermal migration, metal diffuse in extreme environment develop new connection material and packaging method that is suitable in extreme environment. 3) Create the failure criterion and the method of lifetime prediction. Based on the research of failure mechanism and reliability of the semiconductor laser in the extreme environments, the high power semiconductor lasers will be fabricated, which can endure the extreme environment testing, including high temperature(85℃), low temperature (-40℃) and high humidity (65%), thermal cycling (-45~125℃), high mechanical shock (100g), high vibration (5~500Hz) and radiation environment.

近年来，激光加工、航空航天、军事国防等领域对大功率半导体激光器在极端环境下的可靠性提出了越来越高的要求。本项目针对大功率半导体激光器在极端环境下易出现疲劳失效、功率降低、光谱展宽、可靠性降低等问题，通过研究极高温、极低温、高低温循环、高湿、冲击振动、辐射等极端环境下高功率半导体激光器的可靠性及失效机理。建立各种极端环境的实验平台和计算分析模型，研究在极端环境下大功率半导体激光器芯片连接材料热循环、电脉冲疲劳失效机理；研究芯片连接材料的金属间化合物、电迁移和电热迁移、金属扩散现象，探索封装过程中的新原理、新方法，发展适用于极端环境下工作的新型封装材料，建立极端环境下大功率半导体激光器模块失效判据和寿命预测方法。在上述研究基础上，研制出适合于高温85℃、低温-40℃、高湿95%环境下工作，抗冲击100g，振动频率5-500Hz，高低温循环、辐射环境的大功率半导体激光器。

高功率半导体激光器支撑着多个高科技产业的发展，是高能固体激光器和光纤激光器的必需核心器件，具有不可取代的市场先导性和战略先导性。激光加工、航空航天等领域对大功率半导体激光器在极端环境下的可靠性提出了越来越高的要求。本项目针对大功率半导体激光器在极端环境下易出现疲劳失效、功率降低、光谱展宽、可靠性降低等问题，系统研究了极高温、极低温、高低温循环、高湿、高冲击和高振动频率等极端环境下高功率半导体激光器的可靠性及失效机理，取得了如下成果：1) 研制了具有自主知识产权的高功率半导体激光器可靠性表征系统，实现了对半导体激光器阵列失效行为的定量分析诊断；2) 基于粘塑性Anand本构模型和Darveaux能量积累理论，建立了温度循环下半导体激光器阵列键合界面寿命预测模型；3) 建立了正向电压法-空间光谱联合测试平台并提出了基于正向电压法的半导体激光器阵列光谱能量分布的去卷积方法及光谱能量分布（SPD）预测方法，基于该模型能够定量预测不同封装结构、工作条件的高功率半导体激光器阵列光谱能量分布；4) 对无铅焊球研究了不同的电-热-机械应力载荷下焊点界面IMC的生长情况以及焊点内部组织演化，分析了电-热-机械应力对于IMC极化效应的影响；进一步探究了不同载荷和尺寸效应对电迁移失效的影响，找到了最有利于焊点可靠性的条件；5) 研制出了适合于高温85℃、低温-40℃、高湿95%环境下工作，抗冲击100g，振动频率5-500Hz的大功率半导体激光器。通过和炬光科技有限公司合作实现了极端环境工作半导体激光器的产业化。