多因素耦合作用下表/界面效应对微流控芯片注塑过程熔体流动行为影响机理的研究

In this project, taking the process of micro injection molding for microfluidic chips as research object, we will study the surface&interface effects of polymer melts, and will raise a surface&interface effects model in micro scale suitable for micro injection molding filling flow.Based on the theory and testing data of polymer fluid surface&interface property, we will apply nonlinear fitting method to build an analytical model to describe the multi paratmerts related to the effects of surface&interface in micro model chamber.A melt micro fluid dynamic model which considered the effects of surface&interface will be setup to explain the mechanism of the surface&interface effects.Combined with continuous medium numerical simulation and high precision interface tracking reconstruction tecnology, a CAE analysis module will be constructed with the help of open source code as well as an analsis function to describe the surface&interface property.A method was setup to numerically simulate the transition at macro&micro structure in the chamber during injection molding.Based on theoretical study and adjustment of process parameters and micro structure geometrical parameters, the effects of surface&interface can be control and the deffects can be reduced.With this study, we can develop micro injection molding theory and improve the precision of macro/micro injection molding.So far, no similar theoretical models were reported in academic area.

本项目以微流控芯片的注塑成形过程为研究对象，针对成形缺陷问题，研究表/界面效应对熔体流动行为的影响机理，提出一种适合于微注塑充型流动的表/界面效应模型；测试分析聚合物熔体表/界面特性，采用非线性拟合方法，构建描述微型腔中熔体表/界面效应与多因素间的函数关系模型；建立考虑表/界面效应的熔体微观流动动力学模型，揭示表/界面效应的影响机理；结合连续介质数值模拟与高精度界面追踪重构技术，借助开源代码，在动量方程中加入描述熔体表/界面效应的本构方程，构建适用于微注塑成形的CAE分析模块；形成数值模拟微流控芯片注塑过程型腔内的宏微结构过渡的处理方法；基于理论研究，通过优化调整工艺参数和微结构几何参数，控制表/界面效应对熔体流动行为的影响，改善芯片成形缺陷。通过本项目研究，丰富微注塑成形理论，提高微尺度注塑成形过程数值模拟精度。目前，国内外未见本项目所提出的理论模型的报道。

本项目以微流控芯片的注塑成形过程为研究对象，针对成形缺陷问题，研究表/界面效应对熔体流动行为的影响机理，提出一种适合于微注塑充型流动的表/界面效应模型；测试分析聚合物熔体表/界面特性，采用非线性拟合方法，构建描述微型腔中熔体表/界面效应与多因素间的函数关系模型；建立考虑表/界面效应的熔体微观流动动力学模型，揭示表/界面效应的影响机理；结合连续介质数值模拟与高精度界面追踪重构技术，借助开源代码，在动量方程中加入描述熔体表/界面效应的本构方程，构建适用于微注塑成形的CAE分析模块；形成数值模拟微流控芯片注塑过程型腔内的宏微结构过渡的处理方法；基于理论研究，通过优化调整工艺参数和微结构几何参数，控制表/界面效应对熔体流动行为的影响，改善芯片成形缺陷。通过本项目研究，不仅可以丰富微注塑成形理论，提高微尺度注塑成形过程数值模拟精度，而且可以为聚合物宏微纳复合尺度流控芯片的成形提供新的研究思路与方法，从而使研究具有更广泛的物理意义及重要的科学价值。