聚芳醚腈酮上浆剂制备及其对连续碳纤维增强热塑性复合材料界面性能的影响

Carbon fiber reinforced thermoplastic composites (CFRTP) are characterized as high specific strength, high toughness, unlimited storage, short molding cycle and being recoverable, and they have been applied in aerospace, automobile, electronics and other high-tech industries. High performance composite materials have been the goal that researchers always pursue. The properties of the composite are not only dependent on the fiber and the matrix resin, but are also related to the interfacial properties which can be highly influenced by the fiber sizing agent. To deal with the poor adhesive condition between carbon fiber and thermoplastic resin, this project aims to design and synthesize a new kind of poly (aryl ether nitrile ketone) sizing agent by utilizing cyano group, which has strong polar properties and can be cross-linked. We systematically characterize the sized carbon fiber and analyze the influence of the sizing agent on carbon fiber morphology, chemical composition and heat resistance. Following that, we further explore the impact of cyano group on the interfacial properties of composites, and analyze this influence mechanism. Finally, the connection among cyano content, molding temperature, crosslinking degree and interlaminar shear strength of CFRTP was established.

连续碳纤维增强热塑性树脂基复合材料具有比强度高、高韧性、预浸料易存储、成型周期短、可回收等优点，已逐渐应用在航空航天、汽车、电子等高科技领域。其中，高性能复合材料一直是人们追求的目标。复合材料的性能不仅取决于纤维与树脂基体，还与界面性能有着密切联系，而纤维上浆剂起着至关重要的作用。针对碳纤维/热塑性复合材料界面结合强度弱的问题，本项目拟利用氰基强极性、可交联的特点设计制备不同结构的聚芳醚腈酮上浆剂，对上浆后的碳纤维进行系统表征，考察上浆剂对碳纤维形貌、化学组分、耐热性等因素的影响。探索氰基对碳纤维增强热塑性树脂基复合材料界面性能的影响，分析界面增强机理，最终建立氰基含量、工艺温度及交联程度与复合材料层间剪切强度的关系。

连续碳纤维增强热塑性树脂基复合材料具有比强度高、高韧性、预浸料易存储、成型周期短、可回收等优点，已逐渐应用在航空航天、汽车、电子等高科技领域。无定形的聚芳醚酮树脂具有耐高温、可溶解、力学性能优异可作为复合材料的基体树脂。碳纤维密度小，比强度和比模量高，耐高温，是制备先进复合材料的理想增强材料。本项目拟利用氰基强极性、可交联的特点设计制备不同结构的聚芳醚腈酮上浆剂，对上浆后的碳纤维进行系统表征，考察上浆剂对碳纤维形貌、化学组分、耐热性等因素的影响。研究发现，含氰基的聚芳醚酮树脂具有更好的高温流动性，这得益于氰基的大侧基，在相同加工条件下聚芳醚腈酮（PEK-CN）树脂基复合材料比聚芳醚酮（PEK-C）力学性能更高，弯曲强度可达2050MPa，层间剪切强度为120MPa。通过溶液法制备的聚芳醚酮上浆剂浸润碳纤维，成膜性较好，纤维单丝拔出强度为85Mpa，界面强度优于相反转法制备的乳液上浆剂。归因于氰基的交联作用，界面强度随着氰基含量的增加略有提高。