高增益毫米波芯片封装分布式天线技术研究

High-gain integrated antenna has important applications in millimeter-wave communication (including 5G), radar, imaging, detection, etc. However, two available types of integrated antenna, i.e. Antenna-in-Package and Antenna-on-Chip, cannot achieve high gain at any frequency within the millimeter-wave band. On the one hand, restricted by the high interconnection loss, Antenna-in-Package can hardly be used in the middle and high millimeter-wave bands. On the other hand, Antenna-on-Chip either has to rely on bulky and high-profile lens making chip packaging difficult or suffers from small antenna aperture and low efficiency leading to low gain. To solve these problems, this project plans to research a new type of high-gain millimeter-wave integrated antenna. By proposing the new scheme of chip-and-package distributed antenna, exploring new interconnection structures and low-profile aperture radiation structures, this project will bring new design and realization methods of high-gain integrated antennas. The novelties of this project include, (1) the scheme of chip-and-package distributed antenna and new interconnection structures. The antenna structure is distributed both on chip and in package, and the interconnection between the chip and package is by means of the internal coupling of the antenna rather than the direct conductor connection. (2) low-profile aperture radiation structure, which is integrated in the package and can apply amplitude and phase correction on the incident wave to realize high aperture efficiency and high gain. This project is expected to bring new technological breakthrough to millimeter-wave integrated antenna, and thus has important significance.

高增益集成天线在毫米波通信（包括5G）、雷达、成像和探测等方面均有重要应用。但现有的封装天线和片上天线这两种集成天线类型无法满足整个毫米波频段对高增益的需求。封装天线受限于较大的互连损耗，很难应用到毫米波中、高频段；而片上天线要么需要依赖体积大、剖面高的透镜，导致封装困难，要么受限于天线口径和效率，无法获得高增益。为此，本项目拟开展新型高增益毫米波集成天线技术研究，提出芯片封装分布式天线新架构，探索新型互连形式和低剖面口径辐射结构，形成高增益集成天线新的设计方法和实现形式。创新性主要包括：（1）分布式天线结构及新型互连形式。将天线结构分布于芯片和封装，通过天线内部耦合而非导体连接实现由芯片到封装的低损耗互连；（2）低剖面口径辐射结构。集成于封装的口径辐射结构在低剖面条件下对入射电磁波进行幅度与相位校正，实现高口径效率、高增益的辐射。本项目有望为毫米波集成天线带来新的技术突破，具有重要意义。

传统天线基本都是基于一种工艺和/或在一个无线系统模块上实现，这就限制了天线的设计自由度和可以达到的性能。本项目创新的提出分布式天线的设计思想，将天线的各个结构采用不同工艺和/或设计在无线系统的不同部分（例如芯片、封装、基板和机壳），使得天线设计具有更大灵活度，以提升天线性能、增加天线功能。根据这一思想，本项目开展了多种不同频段、功能和应用的分布式天线设计，包括芯片封装分布式天线、封装基板分布式天线以及基于分布式思路的多种天线（如毫米波垂直线极化端射分布式天线、毫米波圆极化端射分布式天线、毫米波高增益环形透镜分布式全向天线、双模谐振低剖双极化分布式全向天线、结构复用双极化分布式八木天线、低剖面阵元环形分布式等通量天线等），取得了较丰富的科研成果。发表SCI期刊论文18篇，其中天线领域顶级期刊IEEE TAP和IEEE TVT论文7篇， IEEE AWPL论文4篇；申请中国发明专利6项，其中5项已经授权；参加了多次国际、国内会议；依托项目培养博士1名，硕士5名；此外，依托项目成果承担华为技术有限公司横向项目2项；制备了多种不同频段、功能和应用的分布式天线样品，包括芯片封装分布式天线、封装基板分布式天线以及基于分布式思路的天线样品。项目研究成果对于未来无线系统的天线设计提供了一个新思路。