石墨烯/环氧树脂复合材料的界面构筑及性能研究

The main objective of this project is to solve the problems exsited in the preparation process of epoxy composites，such as a low level of fracture toughness, dispersion difficulty of fillers and poor interface compatibility between fillers and matrix. Based on the inspiration by nature, we plan to build biomimetic functional graphene by the rational surface molecular design and constuct the good interface compatibility between graphene and epoxy matrix. Besides the facile preparation method and the surface molecular design of biomimetic functional graphene, the systematically investigation of the morphology of the composites, the in-situ polymerization and the curing mechanism would pave the way on how to improve the mechanical properties and thermal properties of the epoxy composites. The research work also supports the establishment of the interfacial mechanism of the biomimetic functional graphene reinforced epoxy composites as well as the corresponding interfacial theoritical model. Futhermore, we realize to utilize the interface biomimetic method to delevop the high performance epoxy composites. In summary, this study not only raise important theoretical value upon the development of high performance epoxy composites, it also demonstrates to promote the development of the new generation high performance composites.

本项目以解决环氧树脂复合材料制备过程中韧性低，增强填料分散困难及界面相容性差等普遍问题为研究目标。受自然界启发，拟以仿生功能化石墨烯为研究对象，对其表面进行有效的仿生结构设计，从而构筑与环氧树脂基体良好相容性的界面。从石墨烯仿生功能化制备和化学结构调控出发，系统研究仿生功能化石墨烯/环氧树脂复合材料的微观结构、原位聚合行为及固化机理与复合材料力学和热学等性能之间的关系，提出仿生功能化石墨烯增强增韧环氧树脂复合材料的界面机理，建立相应的界面理论模型，最终实现从界面仿生学角度优化石墨烯/环氧树脂复合材料的综合性能。项目的研究不仅为石墨烯改性环氧树脂复合材料的高性能化奠定理论基础，而且也为新一代高性能复合材料的设计和制备提供实验与理论借鉴。

随着电子封装技术和大功率器件的快速发展,目前使用的普通环氧树脂电子封装材料的已不能满足先进半导体材料的发展需求。为克服环氧树脂因其韧性低和导热系数低等劣势，难以满足于电子封装等高端领域需要的问题。本项目以石墨烯、功能化石墨烯和环氧树脂等聚合物基体为原料，从分子结构设计出发得到了如仿贝壳砖灰结构、仿豌豆夹结构、仿树叶胞室状结构和褶皱结构等多种具有仿生结构的石墨烯复合材料，评价后发现其石墨烯复合材料具有优异的热学（特别是热传导性能）、力学和电学等综合性能。通过项目的实施，发展了多种石墨烯功能化理论和仿生结构的构筑，建立了石墨烯复合材料的结构与性能之间的关系规律，对其他新型纳米复合材料的设计和开发提供了重要的理论和实践指导，为其在微电子封装领域应用奠定了基础。