阵列式高速红外测温系统研究

It is important for understanding the mechanism of deformation、damage and failure of material under impact load to measure the distribution of temperature field during its dynamic deformation. The function of the array type high speed IR temperature measurement system is irreplaceable to other contact measurement systems in measurement the temperature field of the material under dynamic deformation. At present some high speed IR temperature measurement systems had been developed at home and aboard. But they can't satisfy the need in measuring the temperature field that distributes complicatedly in greater space scale. So this project aims to develop the array type high speed IR temperature measurement system that has the characteristics of high space revolution and high integration level. The 16×16 cooled mercury cadmium telluride IR arrays will be used to increase the space revolution. The high integration level will be realized through two methods as follow. Firstly the capacitive transimpedance amplifier (CTIA) based on CMOS process will be utilized in the front-end readout circuit. Secondly Field Programmable Gate Array (FPGA) will be utilized to design the diver circuit、the control circuit and the high speed data acquisition system to serially readout the data to the computer. The calibration method will be researched to ensure for pricision of temperature measurement. The data processing method will also be researched,. This project will raise the performance of the array type high speed IR temperature measurement system. The achievements of this project will have high application value in high speed impact experiment.

材料动态变形过程中的温度场测量对于认识冲击载荷作用下材料的变形、损伤、破坏机理具有重要意义，阵列式高速红外测温系统在动态变形材料的温度场测量方面的作用是其它测试系统不可替代的，目前国内外研制的一些高速红外测温系统无法满足较大空间范围内温度分布较复杂的温度场测量的需要。基于此原因，本项目的目标是研制高分辨率高集成度的阵列式高速红外测温系统。通过采用16×16的制冷型HgCdTe红外阵列提高测温系统的空间分辨率；高集成度则通过以下两个途径来实现：（1）前端读出电路采用电容反馈跨阻抗放大器（CTIA）型的CMOS读出电路；（2）驱动电路与控制系统、高速数据采集系统基于可编程逻辑器件（FPGA）来设计，实现测温数据结果的串行读出。项目还将开展测温系统标定方法及数据处理方法的研究。该项目的研究将会提高阵列式高速红外测温系统测量高速变形材料温度场的能力，在高冲击实验方面具有很高的应用价值。

材料动态变形过程中的温度场测量对于认识冲击载荷作用下材料的变形、损伤、 破坏机理具有重要意义。本项目研制了基于双施瓦兹希尔德红外光学系统的高速红外测温系统；并发展了原位热电偶法的测温系统标定方法；利用研制的红外测温系统进行了7075-T651铝合金材料Hopkinson压杆实验测温及其塑性功转热系数研究；也对受迫剪切过程中高温合金IN718剪切带的萌生到完全形成的整个过程进行完整表征。