可承载柔性无机电子器件的仿生微结构设计方法及力学性能研究

The bio-integration and bio-inspired applications of flexible, inorganic electronic devices require the device system to possess not only high stretchability, but also low elastic modulus and relatively high load bearing strength. It is a great challenge for the areas of mechanics and materials science to design and manufacture a type of flexible substrate material or device system that combines all those superior mechanical properties. Now, the relevant investigations on the design approach, mechanics theory and experimental measurement of such flexible substrate materials have been rarely explored, which limits, to some extent, the areas of applications for the flexible electronic devices. With the design approach of bio-mimicking flexible substrate material as the main subject, this project will focus on a class of hierarchical lattice material constructed with serpentine microstructures. Combining the finite deformation theory of curved beam and the micromechanics theory of periodic lattices, this project will establish a theoretical model and computational approach for analyzing the mechanical properties of the bio-mimicking flexible materials. Together with the development of fabrication technologies based on the three-dimensional printing and measurement technologies of mechanical behaviors, a quantitative design approach and measurement platform will be formed for the bio-mimicking flexible materials. Furthermore, by integrating the functional devices in the “island-bridge” configuration with the bio-mimicking flexible substrate, a computational approach will be developed to predict the mechanical performances of loading-bearing, flexible, inorganic electronic devices. The results of this research project will provide important theoretical foundation and reliable experimental basis for the applications related to the bio-integration of flexible, inorganic electronic devices.

无机柔性电子器件的生物集成及相关应用需要器件系统不仅具有高的延展率，而且具有低的弹性模量以及较高的承载强度。设计及制备兼具这些优越力学性质的柔性基底材料/器件对力学及材料科学领域提出了很高的挑战，目前仍然非常缺乏相应的设计方法、力学理论及实验研究，这在一定程度上限制了柔性电子器件的应用领域。本项目以仿生柔性基底材料的设计方法作为研究主线，以具有蛇形微结构的一类多级点阵材料作为研究重点，结合曲梁的大变形理论和周期性点阵的细观力学理论，建立仿生柔性材料力学性能分析的理论模型及计算方法，并发展其三维打印制备技术及力学测试技术，从而形成定量化的仿生柔性材料的设计方法及实验测试平台。进一步将基于岛桥构型设计的功能器件与仿生柔性基底进行集成，发展可承载无机柔性电子器件性能预测的计算力学方法。本项目的研究成果将为柔性无机电子器件的生物集成应用提供重要的理论基础及可靠的实验依据。

无机柔性电子器件的生物集成及相关应用需要器件系统同时具有高延展率、低弹性模量以及高承载度。设计并制备兼具这些优越力学性质的柔性基底材料/器件对力学及材料科学领域提出了很高的挑战，目前仍然非常缺乏相应的设计方法、力学理论及实验研究，这使得柔性电子器件在仿生工程、组织工程等领域的应用受到了很大限制。本项目以仿生柔性基底材料的设计为主线，以具有蛇形微结构的一类多级点阵材料作为研究重点，结合曲梁的大变形理论和周期性点阵的细观力学理论，建立了仿生柔性材料力学性能分析的理论模型以及基于单胞结构的大变形计算方法，并发展了其三维打印制备技术及力学测试技术，形成了定量化的仿生柔性材料的设计方法及实验测试平台。进一步将基于岛桥构型设计的功能器件与仿生柔性基底进行集成，发展了可承载无机柔性电子器件性能预测的计算力学方法。本项目的研究成果为柔性无机电子器件的生物集成应用提供了重要的理论基础及可靠的实验依据。