阵列光纤多组元非均质表面的超声与纳米粒子复合抛光机理与技术

The end-faces of fiber array components are multi-materials non-uniform surfaces. Their low polishing quality has become a bottleneck that restricts coupling performance of integrated photoeletronic devices. This project presents a novel high efficiency and high precision polishing method for multi-materials non-uniform surface-ultrasonic vibration assisted chemical mechanical hybrid polishing with combined nanoparticles-to obtain fiber array components with nanometer grade dishing fiber end-face and nanometer grade thickness of damaged layer. The mechanical behaviour of nanoparticles and material microstructure evolution on the CMP interfaces will be studied to reveal the CMP material removal mechanism at atom/molecular scale, the uniformity material removal principle of multi-materials non-uniform surface using combined nanoparticles polishing slurry, the formation mechanism of approaching zero damaged layer; and a fusion model including parameters of both optical transmission interface and CMP interface will try to be created. The experimental process platform of ultrasonic vibration assisted chemical mechanical hybrid polishing with combined nanoparticles for fiber array components will be built to reveal the value quantity laws between polishing process parameters and the end-faces quality of fiber array components. The study can provide an important starting point for researching and developing manufacturing technology and equipments of next generation high performance integrated photoelectronic devices.

阵列光纤组件端面为多组元非均质表面结构，其较低的抛光质量已成为制约集成光电子器件耦合封装性能提升的重要因素,需探索一种创新的高效高精度抛光方法。本项目以实现纳米级光纤端面凹陷及变质层的阵列光纤组件为目标，提出多组元非均质表面的超精密抛光新方法- - 超声与组合纳米粒子化学机械复合抛光技术。从研究抛光界面的纳米粒子力学行为规律和物质微观结构演变出发，揭示抛光界面的原子分子级材料去除机理、组合纳米粒子抛光液对多组元非均质表面的均匀去除原理、近零损伤表面层的生成机制，探索建立光传输界面与抛光界面的融合模型；建立超声与组合纳米粒子化学机械复合抛光阵列光纤组件的工艺试验平台，查明其基本工艺参数与阵列光纤组件端面质量的相关量值规律。研究成果可为自主研发下一代高性能集成光电子器件的制造技术与装备提供指导。

光纤阵列是集成光电子器件的关键组成部分，其端面加工质量直接影响着光信号传输的质量和光纤系统的稳定性。本项目以实现纳米级光纤端面凹陷及变质层的阵列光纤组件为目标，从研究抛光界面的纳米粒子力学行为规律和物质微观结构演变出发，揭示了抛光界面的原子分子级材料去除机理、组合纳米粒子抛光液对多组元非均质表面的均匀去除原理、近零损伤表面层的生成机制。提出了多组元非均质表面的超精密抛光新方法——超声与组合纳米粒子化学机械复合抛光技术。建立了超声与组合纳米粒子化学机械复合抛光阵列光纤组件的工艺试验平台，发现超声椭圆振动辅助化学机械抛光对抑制光纤阵列端面的光纤凹陷、降低表面粗糙度有明显效果,并可使光纤端面的抛光变质层厚度降低至纳米量级。查明了基本抛光工艺参数与阵列光纤组件端面质量的相关量值规律。共发表论文11篇，其中SCI收录2篇，EI收录8篇;授权专利1项；毕业硕士研究生5名。