面向超高速多通道光子集成传输模块的三维叠层封装技术研究

The proposed project aims at the use of microwave three-dimensional stack packaging technology to overcome the microwave crosstalk and signal integrity issues in the ultra-high-speed, multi-channel photonic integrated transmitter modules, where the high-speed (100Gbps) and multi-channel (10 channels) compact packaging for optoelectronic devices will be realized by using this method, and thus the problem that troubles the industry for long will be solved. A microwave three-dimensional packaging technology based on different dielectric materials is proposed for the first time, in order to achieve a high-speed multi-channel microwave packaging for the integrated optoelectronic devices. The research topics include: investigating the material selection and compatibility issues for functional layers in the three-dimensional packaging; build the physical model to explore the the three-dimensional stack packaging structure, analyze and solve the microwave crosstalk and signal integrity problems within different functional layers and channels under various input conditions; find out the low-cost and compact packaging technology for the assembly of three-dimensional stack structure...In this project, the key challenges of the microwave packaging for the high integration and high-speed optical modules will be studied in detail. The technology used and the research results obtained can be widely used in the module packaging field for the high-speed electronic and optoelectronic integrated devices as well as the multi-channel parallel transceiver chips.

本项目旨在利用微波三维叠层封装技术克服超高速、多通道光子集成传输模块内部的微波交叉串扰和信号完整性问题，从而解决目前业界难以实现高速率(100Gbps)、多通道(10通道)光子集成器件的小型化和高集成封装这一技术难题。首次提出了基于不同介电材料的微波三维封装技术，以实现高速多通道光电子器件的高集成化微波封装。主要研究内容包括：解决三维封装中各功能层材料的选择和兼容性问题；建立三维叠层封装结构的物理模型，分析并解决不同信号馈入条件下，各功能层和信道间的微波串扰及信号完整性问题；通过实验研究设计出面向三维叠层结构的低成本、小型化封装工艺。.本项目针对高集成、高速率光模块微波封装中的关键性难题进行深入研究，所采用的工艺技术以及所获得的研究成果以及可广泛应用于高速电子、光电子集成器件以及多通道并行收发芯片的模块化耦合封装领域。

本项利用微波三维叠层封装技术克服超高速、多通道光子集成传输模块内部的微波交叉串扰和信号完整性问题，通过对三维封装结构各功能层材料的选择和兼容性分析研究，解决目前业界难以实现高速率(100Gbps)、多通道(10通道)光子集成器件的小型化和高集成封装这一技术难题。用基于不同介电材料的微波三维封装技术，实现了高速多通道光电子器件的高集成化微波封装。解决三维封装中各功能层材料的选择和兼容性问题；建立三维叠层封装结构的物理模型，分析并解决不同信号馈入条件下，各功能层和信道间的微波串扰及信号完整性问题；实验研究设计出面向三维叠层结构的低成本、小型化封装工艺；测试了三维封装结构高频特性。解决了高集成、高速率光模块微波封装中的关键性难题。在项目执行期间专利授权两篇。我们所采用的工艺技术以及所获得的研究成果将用于高速电子、光电子集成器件以及多通道并行收发芯片的模块化耦合封装领域中。